{"title":"BGA焊料球在海洋极端环境下的应用可靠性研究","authors":"Liyuan Liu, T. Lu, D. Luo, Hui Xiao","doi":"10.1109/ECTC.2019.00315","DOIUrl":null,"url":null,"abstract":"The paper simulates the pressure of extreme marine environment, carries out pressure test on BGA devices, studies the changes and trends of BGA solder joints before and after test, analyses the reliability changes and the potential risks. The model of BGA solder joints is established by means of finite element modeling, and the influence of the position and size of voids in BGA solder joints after reflow soldering in pressure test is studied. Therefore, the preventive inspection measures for the corresponding reliability risk of BGA solder joints are put forward, which provides reliability assurance advice for BGA solder joints exposed to extreme marine environment.","PeriodicalId":6726,"journal":{"name":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","volume":"107 1","pages":"2054-2060"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Research on Applied Reliability of BGA Solder Balls in Extreme Marine Environment\",\"authors\":\"Liyuan Liu, T. Lu, D. Luo, Hui Xiao\",\"doi\":\"10.1109/ECTC.2019.00315\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper simulates the pressure of extreme marine environment, carries out pressure test on BGA devices, studies the changes and trends of BGA solder joints before and after test, analyses the reliability changes and the potential risks. The model of BGA solder joints is established by means of finite element modeling, and the influence of the position and size of voids in BGA solder joints after reflow soldering in pressure test is studied. Therefore, the preventive inspection measures for the corresponding reliability risk of BGA solder joints are put forward, which provides reliability assurance advice for BGA solder joints exposed to extreme marine environment.\",\"PeriodicalId\":6726,\"journal\":{\"name\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"107 1\",\"pages\":\"2054-2060\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2019.00315\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2019.00315","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Research on Applied Reliability of BGA Solder Balls in Extreme Marine Environment
The paper simulates the pressure of extreme marine environment, carries out pressure test on BGA devices, studies the changes and trends of BGA solder joints before and after test, analyses the reliability changes and the potential risks. The model of BGA solder joints is established by means of finite element modeling, and the influence of the position and size of voids in BGA solder joints after reflow soldering in pressure test is studied. Therefore, the preventive inspection measures for the corresponding reliability risk of BGA solder joints are put forward, which provides reliability assurance advice for BGA solder joints exposed to extreme marine environment.
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