2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

查看最新文献

7240

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - 最新文献

Further Enhancement of Thermal Conductivity through Optimal Uses of h-BN Fillers in Polymer-Based Thermal Interface Material for Power Electronics

Pub Date : 2019-08-26 DOI: 10.1109/ECTC.2019.00241 Hanqing Jiang, Han Zhou, S. Robertson, Zhaoxia Zhou, Liguo Zhao, Changqing Liu

A Novel Design of a Bandwidth Enhanced Dual-Band Impedance Matching Network with Coupled Line Wave Slowing

Pub Date : 2019-05-30 DOI: 10.1109/ECTC.2019.00271 D. Banerjee, A. Saxena, M. Hashmi

Die-to-Wafer (D2W) Processing and Reliability for 3D Packaging of Advanced Node Logic

Pub Date : 2019-05-28 DOI: 10.1109/ECTC.2019.00096 L. England, D. Fisher, K. Rivera, B. Guthrie, Ping-Jui Kuo, Chang-Chi Lee, Che-Ming Hsu, Fan-Yu Min, Kuo-Chang Kang, Chen-Yuan Weng

查看全部

免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。