非释放微结构的可靠性:失效分析和创新解决过程

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. Pub Date : 2005-06-05 DOI:10.1109/SENSOR.2005.1496548

O. Millet, P. Muller, O. Blanrue, B. Legrand, D. Collard, L. Buchaillot

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引用次数: 0

摘要

本文研究了由于制造过程中两个步骤之间的储存而导致的微观结构失效，并提出了一种避免这些失效的创新工艺。移动部件上的纳米压痕在制造过程、释放结构的校正过程和逆向工程中的应用。

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Reliability of non-released microstructures: failure analysis and innovative solution process

The paper deals with the investigation of microstructure failures due to storage between two steps of the fabrication process, and with the presentation of an innovative process avoiding these failures. Applications in fabrication process, corrective processes on released structures and reverse engineering are thanks to nanoindentation on mobile parts.

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来源期刊

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.

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