Xiao Sun, Hesheng Lin, D. Velenis, J. Slabbekoorn, G. Talmelli, P. Bex, T. Sterken, R. Lauwereins, C. Adelmann, Andy Miller, G. van der Plas, E. Beyne
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引用次数: 2
摘要
我们展示了一个积分$110-\mu \ mathm {m}$的新概念。扇形圆片级封装(FOWLP)中的厚低阻高q磁芯电感。与薄膜磁芯电感器[1]不同，该解决方案提供了嵌入厚磁芯以满足功率密度要求的可能性，在1.2 W /mm2功率密度下实现89%的效率，并使用圆形磁电感器与背面电力输送网络(BSPDN)进行2:1的功率转换。
3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Effi- ciency Buck Converter with Backside Power Delivery Network
We demonstrate a novel concept of integrating $110-\mu \mathrm{m}$. thick low-resistance high-Q magnetic core inductors in fan-out wafer level packaging (FOWLP). Unlike thin-film magnetic core inductors [1], this solution offers the possibility to embed thick cores to meet power density requirements, allowing for 89% efficiency at 1.2 W /mm2 power density for 2: 1 power conversion with a backside power delivery network (BSPDN) using circular-shaped magnetic inductors.
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