基于毫米波碳纳米管的倒装芯片共面互连

Joseph M. de Saxcé, Philippe Roux-Lévy, Chun Fei Siah, Jianxiong Wang, B. Tay, P. Coquet, D. Baillargeat
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引用次数: 0

摘要

在这项工作中,我们研究了垂直排列碳纳米管(VACNT)阵列在高频互连中的性能。本研究的频率范围为W频段(75 GHz至110 GHz)。互连的类型是共面的,这意味着互连可以连接两个支持共面波导(CPW)模式的子部件。从先前测量设备的有希望的结果开始[1],我们提出了一种改善VACNT阵列互连行为的方法。我们对即将制造和测试的新结构进行全波建模,并比较了设计这种互连的不同建模方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects
In this work, we investigate the performances of vertically aligned carbon nanotube (VACNT) arrays for high frequency interconnects. The frequency range of this study is the W band (75 GHz to 110 GHz). The type of interconnect is coplanar, meaning the interconnect can connect two subparts supporting a coplanar waveguide (CPW) mode. Starting from the promising results of a previously measured device [1] we suggest a way to improve the behavior of VACNT arrays interconnects. We perform full-wave modeling of a new structure that will be fabricated and tested and we compare different modelling approaches for the design of such interconnects.
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