Joseph M. de Saxcé, Philippe Roux-Lévy, Chun Fei Siah, Jianxiong Wang, B. Tay, P. Coquet, D. Baillargeat
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Millimeter Wave Carbon Nanotube Based Flip Chip Coplanar Interconnects
In this work, we investigate the performances of vertically aligned carbon nanotube (VACNT) arrays for high frequency interconnects. The frequency range of this study is the W band (75 GHz to 110 GHz). The type of interconnect is coplanar, meaning the interconnect can connect two subparts supporting a coplanar waveguide (CPW) mode. Starting from the promising results of a previously measured device [1] we suggest a way to improve the behavior of VACNT arrays interconnects. We perform full-wave modeling of a new structure that will be fabricated and tested and we compare different modelling approaches for the design of such interconnects.