{"title":"磁控溅射离子镀制备铜(Cu2O)、副乌头矿(Cu32+Cu21+O4)和钛矿(CuO): EPMA、XRD、HEED和SEM表征","authors":"A. v. Richthofen, R. Domnick, R. Cremer","doi":"10.1007/S002160050415","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":12375,"journal":{"name":"Fresenius' Journal of Analytical Chemistry","volume":"32 1","pages":"312-315"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"30","resultStr":"{\"title\":\"Preparation of cuprite (Cu2O), paramelaconite (Cu32+Cu21+O4) and tenorite (CuO) with magnetron sputtering ion plating: characterization by EPMA, XRD, HEED and SEM\",\"authors\":\"A. v. Richthofen, R. Domnick, R. Cremer\",\"doi\":\"10.1007/S002160050415\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":12375,\"journal\":{\"name\":\"Fresenius' Journal of Analytical Chemistry\",\"volume\":\"32 1\",\"pages\":\"312-315\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"30\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fresenius' Journal of Analytical Chemistry\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1007/S002160050415\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fresenius' Journal of Analytical Chemistry","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/S002160050415","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Preparation of cuprite (Cu2O), paramelaconite (Cu32+Cu21+O4) and tenorite (CuO) with magnetron sputtering ion plating: characterization by EPMA, XRD, HEED and SEM