微加工硅片共面接地波导技术与测试

A. Lucibello, G. de Angelis, E. Proietti, R. Marcelli, G. Bartolucci
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引用次数: 0

摘要

通过高电阻率硅片的微加工,设计并实现了共面波导接地线(CPWG),并进行了高达40 GHz的测试。通过改变用于接地的微加工过孔的尺寸、数量和间距,比较了它们之间的不同配置,得到了最优的电气匹配条件。在40 GHz范围内获得了低至0.1-0.2 dB/mm的宽带匹配和损耗,与预测行为一致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Technology and test of coplanar grounded wave-guides on micro-machined Si wafers
Coplanar wave-guide grounded lines (CPWG) have been designed, realized by micro-machining of high resistivity silicon wafers and tested up to 40 GHz. Different configurations have been compared between them by changing the dimensions of the micro-machined via-holes used for the ground connection, as well as their number and separation, to get the optimal electrical matching conditions. Wide-band matching and losses as low as 0.1-0.2 dB/mm have been obtained within the 40 GHz range, in agreement with the predicted behaviour.
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