基于刀屑界面介质涂层阻抗模型的加工过程监控方法

IF 1 Q4 ENGINEERING, MANUFACTURING
Heebum Chun, Jungsub Kim, Jungsoo Nam, Songhyun Ju, Chabum Lee
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引用次数: 0

摘要

在这项研究中,我们研究了一种利用刀具介质涂层的阻抗特性在刀具-芯片接口(TCI)上实现加工过程监控的新方法。本研究首先利用阻抗分析仪对刀具表面涂覆的几微米厚介电层在不同温度条件下的阻抗响应特征Nyquist图进行分析,建立介电层的相对介电常数与温度的关系。因此,介电层的阻抗会根据给定的温度条件发生变化。因此,在其与温度相关的阻抗特性下,通过直接探测加工过程中局部的TCI,即所谓的切削热点,可以对加工过程进行现场跟踪和分析。在加工系统中实现了电流源,并监测了加工过程中TCI处的阻抗变化。因此,在不同的加工条件下,阻抗响应发生了显著的变化。进一步表征了不同接触深度下的阻抗,阻抗随接触深度的增加而减小。因此,初步研究表明,介质涂层的电阻抗模型可用于加工过程监测方法,以分析和评估加工过程在局部TCI区域的现象。该研究有望在先进制造中提供潜在的应用,以提高最终零件的质量和生产率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
In-Process Machining Process Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface
In this study, we investigated a novel approach that enables the in-process machining process monitoring at the tool-chip interface (TCI) by utilizing the impedance characteristics of the dielectric coating layer of the cutting tool. This study first analyzes the Nyquist diagram that characterizes the impedance response of a few micrometer-thick dielectric layers coated on the surface of the cutting tool by using an impedance analyzer under various temperature conditions for establishing the relationship between the relative permittivity of the dielectric layer and temperature. Consequently, the impedance of the dielectric layer was subject to change according to given temperature conditions. Thus, under its temperature-dependent impedance characteristics, the machining processes could be in-situ tracked and analyzed by directly probing the localized TCI, the so-called cutting hot spot, during the machining. The current source was implemented with the machining system and the variations of impedance at TCI were monitored during the facing process. As a result, impedance responses were remarkably changed under various machining conditions. The impedance was further characterized under the varying depth of contact and the impedance was decreased as the depth of contact increased. Therefore, the preliminary study demonstrated that an electrical impedance model of the dielectric coating layer may be applied for an in-process machining process monitoring method to analyze and assess the phenomenon of the machining process at the local TCI region. This study is expected to potentially provide utilization in advanced manufacturing to improve final part quality and productivity.
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来源期刊
Journal of Micro and Nano-Manufacturing
Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-
CiteScore
2.70
自引率
0.00%
发文量
12
期刊介绍: The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.
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