Heebum Chun, Jungsub Kim, Jungsoo Nam, Songhyun Ju, Chabum Lee
{"title":"基于刀屑界面介质涂层阻抗模型的加工过程监控方法","authors":"Heebum Chun, Jungsub Kim, Jungsoo Nam, Songhyun Ju, Chabum Lee","doi":"10.1115/msec2022-85794","DOIUrl":null,"url":null,"abstract":"\n In this study, we investigated a novel approach that enables the in-process machining process monitoring at the tool-chip interface (TCI) by utilizing the impedance characteristics of the dielectric coating layer of the cutting tool. This study first analyzes the Nyquist diagram that characterizes the impedance response of a few micrometer-thick dielectric layers coated on the surface of the cutting tool by using an impedance analyzer under various temperature conditions for establishing the relationship between the relative permittivity of the dielectric layer and temperature. Consequently, the impedance of the dielectric layer was subject to change according to given temperature conditions. Thus, under its temperature-dependent impedance characteristics, the machining processes could be in-situ tracked and analyzed by directly probing the localized TCI, the so-called cutting hot spot, during the machining. The current source was implemented with the machining system and the variations of impedance at TCI were monitored during the facing process. As a result, impedance responses were remarkably changed under various machining conditions. The impedance was further characterized under the varying depth of contact and the impedance was decreased as the depth of contact increased. Therefore, the preliminary study demonstrated that an electrical impedance model of the dielectric coating layer may be applied for an in-process machining process monitoring method to analyze and assess the phenomenon of the machining process at the local TCI region. This study is expected to potentially provide utilization in advanced manufacturing to improve final part quality and productivity.","PeriodicalId":45459,"journal":{"name":"Journal of Micro and Nano-Manufacturing","volume":null,"pages":null},"PeriodicalIF":1.0000,"publicationDate":"2022-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"In-Process Machining Process Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface\",\"authors\":\"Heebum Chun, Jungsub Kim, Jungsoo Nam, Songhyun Ju, Chabum Lee\",\"doi\":\"10.1115/msec2022-85794\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n In this study, we investigated a novel approach that enables the in-process machining process monitoring at the tool-chip interface (TCI) by utilizing the impedance characteristics of the dielectric coating layer of the cutting tool. This study first analyzes the Nyquist diagram that characterizes the impedance response of a few micrometer-thick dielectric layers coated on the surface of the cutting tool by using an impedance analyzer under various temperature conditions for establishing the relationship between the relative permittivity of the dielectric layer and temperature. Consequently, the impedance of the dielectric layer was subject to change according to given temperature conditions. Thus, under its temperature-dependent impedance characteristics, the machining processes could be in-situ tracked and analyzed by directly probing the localized TCI, the so-called cutting hot spot, during the machining. The current source was implemented with the machining system and the variations of impedance at TCI were monitored during the facing process. As a result, impedance responses were remarkably changed under various machining conditions. The impedance was further characterized under the varying depth of contact and the impedance was decreased as the depth of contact increased. Therefore, the preliminary study demonstrated that an electrical impedance model of the dielectric coating layer may be applied for an in-process machining process monitoring method to analyze and assess the phenomenon of the machining process at the local TCI region. This study is expected to potentially provide utilization in advanced manufacturing to improve final part quality and productivity.\",\"PeriodicalId\":45459,\"journal\":{\"name\":\"Journal of Micro and Nano-Manufacturing\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.0000,\"publicationDate\":\"2022-06-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Micro and Nano-Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/msec2022-85794\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micro and Nano-Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/msec2022-85794","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
In-Process Machining Process Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface
In this study, we investigated a novel approach that enables the in-process machining process monitoring at the tool-chip interface (TCI) by utilizing the impedance characteristics of the dielectric coating layer of the cutting tool. This study first analyzes the Nyquist diagram that characterizes the impedance response of a few micrometer-thick dielectric layers coated on the surface of the cutting tool by using an impedance analyzer under various temperature conditions for establishing the relationship between the relative permittivity of the dielectric layer and temperature. Consequently, the impedance of the dielectric layer was subject to change according to given temperature conditions. Thus, under its temperature-dependent impedance characteristics, the machining processes could be in-situ tracked and analyzed by directly probing the localized TCI, the so-called cutting hot spot, during the machining. The current source was implemented with the machining system and the variations of impedance at TCI were monitored during the facing process. As a result, impedance responses were remarkably changed under various machining conditions. The impedance was further characterized under the varying depth of contact and the impedance was decreased as the depth of contact increased. Therefore, the preliminary study demonstrated that an electrical impedance model of the dielectric coating layer may be applied for an in-process machining process monitoring method to analyze and assess the phenomenon of the machining process at the local TCI region. This study is expected to potentially provide utilization in advanced manufacturing to improve final part quality and productivity.
期刊介绍:
The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.