三元固溶体中溶质原子空位分布的一般处理及其在Al-Cu-Sn合金低温时效中的应用(冶金)

H. Kimura, R. Hasiguti
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引用次数: 4

摘要

给出了计算三元稀固溶体中空位-溶质原子对浓度的一般处理方法。这种处理方法适用于相对于一种溶质原子浓度的较大空位浓度范围。应用该处理解释了添加锡对Al-Cu合金低温时效速率的影响。分析了Al-Cu合金和Al-Cu- sn合金的时效活化能差异,发现空位-锡原子对的结合能比空位-铜原子对的结合能大0.3eV左右。实验结果表明,只有当锡浓度大于空位浓度时,锡的加入才有明显的延缓老化的作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A General Treatment of the Distribution of Vacancies to Solute Atoms in a Ternary Solid Solution and its Application to Low Temperature Aging in Al-Cu-Sn Alloys(Metallurgy)
A general treatment to calculate the concentration of vacancy-solute atom pairs in a ternary dilute solid solution is presented. This treatment is applicable to a wide range of vacancy concentration relative to the concentration of one kind of solute atoms. The treatment is applied to explain the effect of tin addition on the rates of low temperature aging in Al-Cu alloys. The difference in the activation energy for aging between Al-Cu alloys and an Al-Cu-Sn alloy is analyzed to find the binding energy of a vacancy-tin atom pair to be about 0.3eV larger than that of a vacancy-copper atom pair. The experimental result that the retardation of aging due to tin addition is appreciable only for tin concentrations larger than the vacancy concentration is also explained satisfactorily.
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