Chia-Che Chung, Hsin-Cheng Lin, H. H. Lin, W. K. Wan, M. Yang, C. Liu
{"title":"可解释的神经网络模拟和减少FinFET电路的自热","authors":"Chia-Che Chung, Hsin-Cheng Lin, H. H. Lin, W. K. Wan, M. Yang, C. Liu","doi":"10.1109/VLSITechnology18217.2020.9265107","DOIUrl":null,"url":null,"abstract":"An interpretable neural network (NN) is used to model the self-heating (SH) in complex FinFET circuits. The NN training/testing datasets from 3 -stage to 37 -stage chain circuits in folded layout composed of inverter (INV)/NAND/NOR are simulated by our distributed $\\mathrm{R}_{\\mathrm{th}}-\\mathrm{C}_{\\mathrm{th}}$ SPICE model [1], [2]. The interfacial thermal resistance [3], boundary scattering [4], alloy scattering [5], and layout dependence are considered. The NN interpretation by feature importance analysis is consistent with the thermal physics. Stage# is the most important feature of the NN prediction. Both via2 bundle positions and via2 numbers (via2#) are effective to reduce SH. As compared to SPICE, NN prediction in 37 -stage INV chain computes $3\\mathrm{x}10^{6}\\mathrm{X}$ faster with accuracy loss $< 1^{\\circ}\\mathrm{C}$. The high computation efficiency and high precision make NN feasible to predict chain circuits up to 40 stages, which cannot be simulated by SPICE due to long computation time.","PeriodicalId":6850,"journal":{"name":"2020 IEEE Symposium on VLSI Technology","volume":"35 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Interpretable Neural Network to Model and to Reduce Self-Heating of FinFET Circuitry\",\"authors\":\"Chia-Che Chung, Hsin-Cheng Lin, H. H. Lin, W. K. Wan, M. Yang, C. Liu\",\"doi\":\"10.1109/VLSITechnology18217.2020.9265107\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An interpretable neural network (NN) is used to model the self-heating (SH) in complex FinFET circuits. The NN training/testing datasets from 3 -stage to 37 -stage chain circuits in folded layout composed of inverter (INV)/NAND/NOR are simulated by our distributed $\\\\mathrm{R}_{\\\\mathrm{th}}-\\\\mathrm{C}_{\\\\mathrm{th}}$ SPICE model [1], [2]. The interfacial thermal resistance [3], boundary scattering [4], alloy scattering [5], and layout dependence are considered. The NN interpretation by feature importance analysis is consistent with the thermal physics. Stage# is the most important feature of the NN prediction. Both via2 bundle positions and via2 numbers (via2#) are effective to reduce SH. As compared to SPICE, NN prediction in 37 -stage INV chain computes $3\\\\mathrm{x}10^{6}\\\\mathrm{X}$ faster with accuracy loss $< 1^{\\\\circ}\\\\mathrm{C}$. The high computation efficiency and high precision make NN feasible to predict chain circuits up to 40 stages, which cannot be simulated by SPICE due to long computation time.\",\"PeriodicalId\":6850,\"journal\":{\"name\":\"2020 IEEE Symposium on VLSI Technology\",\"volume\":\"35 1\",\"pages\":\"1-2\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE Symposium on VLSI Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSITechnology18217.2020.9265107\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSITechnology18217.2020.9265107","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interpretable Neural Network to Model and to Reduce Self-Heating of FinFET Circuitry
An interpretable neural network (NN) is used to model the self-heating (SH) in complex FinFET circuits. The NN training/testing datasets from 3 -stage to 37 -stage chain circuits in folded layout composed of inverter (INV)/NAND/NOR are simulated by our distributed $\mathrm{R}_{\mathrm{th}}-\mathrm{C}_{\mathrm{th}}$ SPICE model [1], [2]. The interfacial thermal resistance [3], boundary scattering [4], alloy scattering [5], and layout dependence are considered. The NN interpretation by feature importance analysis is consistent with the thermal physics. Stage# is the most important feature of the NN prediction. Both via2 bundle positions and via2 numbers (via2#) are effective to reduce SH. As compared to SPICE, NN prediction in 37 -stage INV chain computes $3\mathrm{x}10^{6}\mathrm{X}$ faster with accuracy loss $< 1^{\circ}\mathrm{C}$. The high computation efficiency and high precision make NN feasible to predict chain circuits up to 40 stages, which cannot be simulated by SPICE due to long computation time.