微电子封装用环氧树脂/硅衬底系统的水分辅助失效机制

Marta Giachino, F. Paredes, N. Ananthakrishnan, S. Liff, R. Dauskardt
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引用次数: 3

摘要

湿度和机械应力对半导体封装中环氧树脂脱粘动力学的协同作用越来越为人所知,然而,增加温度和湿度的显著影响尚不为人所知。我们展示了一种定量测量含有广泛填料颗粒的下填料环氧树脂的机械和动力学行为的方法。在双酚f基树脂中加入填料后,环氧树脂/硅界面处的断裂能比未填充的环氧树脂/硅界面处的断裂能大大增加。我们描述了每种填充环氧树脂与相邻钝化硅衬底的内聚性和粘附性,并报告了在不同湿度和温度环境下的湿辅助脱粘动力学,包括加速测试条件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Moisture-assisted failure mechanisms in underfill epoxy/silicon systems for microelectronic packaging
Synergistic effects of moisture and mechanical stress on debond kinetics of underfill epoxies used in semiconductor packaging are increasingly understood, however, the dramatic effect of increasing both temperature and humidity is not well known. We demonstrate a way to quantitatively measure the mechanical and kinetic behavior of an underfill epoxy resin containing a broad range of filler particles. With the introduction of fillers into the bisphenol-F-based resin, the fracture energy at the epoxy/Si interface is largely increased compared to the unfilled epoxy/Si interface. We characterize the cohesive and adhesive properties of each filled epoxy to the adjacent passivated silicon substrate and report on the moisture-assisted debonding kinetics in varying humidity and temperature environments, including accelerated testing conditions.
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