{"title":"基于TLP技术的集成电路ESD保护结构失效分析","authors":"Jiang Xie, Q. Shi, Yue Gao","doi":"10.1109/ICEPT.2016.7583354","DOIUrl":null,"url":null,"abstract":"This paper introduces an evaluation method of integrated circuit port protection structure burn-out mechanism basing on transmission line pulse test (TLP). Based on the analysis of a variety of typical ESD protection circuit structures of integrated circuit, the design procedure of TLP test scheme is provided. By establishing functional relation between I/V characteristic curves and the ESD damage failure of protection circuit, the level and consequence of integrated circuit ESD failure can be quantified precisely, the root causes also can be confirmed. With a failure analysis case of a typical clamp protection structure of 0.18μm process verifies the feasibility of the technique.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"6 1","pages":"1267-1271"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Integrated circuit ESD protection structure failure analysis based on TLP technique\",\"authors\":\"Jiang Xie, Q. Shi, Yue Gao\",\"doi\":\"10.1109/ICEPT.2016.7583354\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper introduces an evaluation method of integrated circuit port protection structure burn-out mechanism basing on transmission line pulse test (TLP). Based on the analysis of a variety of typical ESD protection circuit structures of integrated circuit, the design procedure of TLP test scheme is provided. By establishing functional relation between I/V characteristic curves and the ESD damage failure of protection circuit, the level and consequence of integrated circuit ESD failure can be quantified precisely, the root causes also can be confirmed. With a failure analysis case of a typical clamp protection structure of 0.18μm process verifies the feasibility of the technique.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"6 1\",\"pages\":\"1267-1271\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583354\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583354","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integrated circuit ESD protection structure failure analysis based on TLP technique
This paper introduces an evaluation method of integrated circuit port protection structure burn-out mechanism basing on transmission line pulse test (TLP). Based on the analysis of a variety of typical ESD protection circuit structures of integrated circuit, the design procedure of TLP test scheme is provided. By establishing functional relation between I/V characteristic curves and the ESD damage failure of protection circuit, the level and consequence of integrated circuit ESD failure can be quantified precisely, the root causes also can be confirmed. With a failure analysis case of a typical clamp protection structure of 0.18μm process verifies the feasibility of the technique.