{"title":"具有理想和非理想返回路径的耦合分布RLC线的解析模型","authors":"A. Naeemi, J.A. Davis, J. Meindl","doi":"10.1109/IEDM.2001.979604","DOIUrl":null,"url":null,"abstract":"New analytical models that describe distributed RLC interconnects with ideal and nonideal return paths are used to optimize the time delay and crosstalk of a state-of-the-art high-speed global interconnect structure that incorporates coplanar ground lines such that the delay and crosstalk are reduced by 12% and 38%, respectively.","PeriodicalId":13825,"journal":{"name":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","volume":"58 1","pages":"31.4.1-31.4.4"},"PeriodicalIF":0.0000,"publicationDate":"2001-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Analytical models for coupled distributed RLC lines with ideal and nonideal return paths\",\"authors\":\"A. Naeemi, J.A. Davis, J. Meindl\",\"doi\":\"10.1109/IEDM.2001.979604\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"New analytical models that describe distributed RLC interconnects with ideal and nonideal return paths are used to optimize the time delay and crosstalk of a state-of-the-art high-speed global interconnect structure that incorporates coplanar ground lines such that the delay and crosstalk are reduced by 12% and 38%, respectively.\",\"PeriodicalId\":13825,\"journal\":{\"name\":\"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)\",\"volume\":\"58 1\",\"pages\":\"31.4.1-31.4.4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2001.979604\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2001.979604","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analytical models for coupled distributed RLC lines with ideal and nonideal return paths
New analytical models that describe distributed RLC interconnects with ideal and nonideal return paths are used to optimize the time delay and crosstalk of a state-of-the-art high-speed global interconnect structure that incorporates coplanar ground lines such that the delay and crosstalk are reduced by 12% and 38%, respectively.