具有理想和非理想返回路径的耦合分布RLC线的解析模型

A. Naeemi, J.A. Davis, J. Meindl
{"title":"具有理想和非理想返回路径的耦合分布RLC线的解析模型","authors":"A. Naeemi, J.A. Davis, J. Meindl","doi":"10.1109/IEDM.2001.979604","DOIUrl":null,"url":null,"abstract":"New analytical models that describe distributed RLC interconnects with ideal and nonideal return paths are used to optimize the time delay and crosstalk of a state-of-the-art high-speed global interconnect structure that incorporates coplanar ground lines such that the delay and crosstalk are reduced by 12% and 38%, respectively.","PeriodicalId":13825,"journal":{"name":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","volume":"58 1","pages":"31.4.1-31.4.4"},"PeriodicalIF":0.0000,"publicationDate":"2001-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Analytical models for coupled distributed RLC lines with ideal and nonideal return paths\",\"authors\":\"A. Naeemi, J.A. Davis, J. Meindl\",\"doi\":\"10.1109/IEDM.2001.979604\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"New analytical models that describe distributed RLC interconnects with ideal and nonideal return paths are used to optimize the time delay and crosstalk of a state-of-the-art high-speed global interconnect structure that incorporates coplanar ground lines such that the delay and crosstalk are reduced by 12% and 38%, respectively.\",\"PeriodicalId\":13825,\"journal\":{\"name\":\"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)\",\"volume\":\"58 1\",\"pages\":\"31.4.1-31.4.4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2001.979604\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2001.979604","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

新的分析模型描述了具有理想和非理想返回路径的分布式RLC互连,用于优化包含共面地线的最先进的高速全球互连结构的时间延迟和串扰,使延迟和串扰分别减少了12%和38%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analytical models for coupled distributed RLC lines with ideal and nonideal return paths
New analytical models that describe distributed RLC interconnects with ideal and nonideal return paths are used to optimize the time delay and crosstalk of a state-of-the-art high-speed global interconnect structure that incorporates coplanar ground lines such that the delay and crosstalk are reduced by 12% and 38%, respectively.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信