CuTeCrY合金的显微组织及二相强化机制

IF 1.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Science and Technology Pub Date : 2023-05-22 DOI:10.1080/02670836.2023.2210912

Lixun Deng, Liukui Gong, Shixin Song, Yansong Zhang, Hongwei Feng, Ziming Chen, Hefeng Yuan, Wei Huang

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引用次数: 1

摘要

经均匀退火、热挤压、固溶处理、冷拔和热时效处理制备的CuTeCrY合金抗拉强度和电导率分别为430 MPa和78.9% IACS。电镜分析表明，时效处理消除了固溶合金中亚稳的CrCu2Te相，在基体中分布了3 ~ 5 nm的bcc-Cr相。纳米Cr第二相是合金强化的主要贡献者，而微米Cr和Te第二相的强化作用较弱。

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Microstructure and second-phase strengthening mechanisms of CuTeCrY alloy

A CuTeCrY alloy prepared by homogenising annealing, hot extrusion, solution treatment, cold drawing, and a heat ageing treatment has tensile strength and electrical conductivity of 430 MPa and 78.9% IACS, respectively. Electron microscopy analyses show that a metastable CrCu2Te phase in the solid solution alloy is eliminated by the ageing treatment, and a 3–5 nm granular bcc-Cr phase becomes distributed in the matrix. This nanometre Cr second phase is the main contributor to the strengthening of the alloy whereas the second-phase strengthening effects of micrometre Cr and Te phases are weak.

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来源期刊

Materials Science and Technology 工程技术-材料科学：综合

CiteScore

2.70

自引率

5.60%

发文量

审稿时长

3 months

期刊介绍：《Materials Science and Technology》（MST） is an international forum for the publication of refereed contributions covering fundamental and technological aspects of materials science and engineering.