用于低于0.1 /spl mu/m的nmosfet的锑辅助砷S/D扩展(A/sup 3/ SDE)工程:一种陡峭和逆行铟口袋轮廓的新方法

H. Wang, C.C. Wang, C. Hsieh, S. Lu, M. Chiang, Y. Chu, C. Chen, T. Ong, Tahui Wang, P. Griffin, C. H. Diaz
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引用次数: 2

摘要

我们提出了一种新的工艺,即采用锑辅助砷源/漏极扩展(a /sup 3/ SDE)来实现低于0.1 /spl mu/m的nmosfet的陡峭和逆行铟口袋轮廓。通过设计由铟植入物产生的非晶层中的缺陷分布,该新工艺在保持相同的I/sub off/的情况下,将电流驱动提高了8%。它使nMOS二极管泄漏减少了两个数量级,栅极附近的侧壁结电容减少了14%。对A/sup 3/ SDE工艺制备的器件的可靠性评估表明,热载子效应得到了显著改善,栅极氧化物完整性没有明显下降。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Antimony assisted arsenic S/D extension (A/sup 3/ SDE) engineering for sub-0.1 /spl mu/m nMOSFETs : a novel approach to steep and retrograde indium pocket profiles
We propose a novel process whereby Antimony Assisted Arsenic Source/Drain Extension (A/sup 3/ SDE) is employed to realize a steep and retrograde indium pocket profile for sub-0.1 /spl mu/m nMOSFETs. By engineering the defect distributions in the amorphous layer created by an indium implant, this new process improves by 8% the current drive while maintaining the same I/sub off/. It reduces nMOS diode leakage by two orders of magnitude and sidewall junction capacitance near the gate by 14%. Reliability assessment of devices fabricated by the A/sup 3/ SDE process reveals significant improvement in hot carrier effects and no observable degradation of gate oxide integrity.
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