T. Fukushima, Y. Susumago, H. Kino, Tetsu Tanaka, A. Alam, A. Hanna, S. Iyer
{"title":"FlexTrate™的自组装技术","authors":"T. Fukushima, Y. Susumago, H. Kino, Tetsu Tanaka, A. Alam, A. Hanna, S. Iyer","doi":"10.1109/ECTC.2018.00275","DOIUrl":null,"url":null,"abstract":"We have developed new flexible hybrid electronics (FHE) systems called FlexTrateTM that is high-performance and scalable flexible substrates embedding heterogeneous inorganic monocrystalline semiconductor dielets. In this work, a modified die-first FOWLP technology with surface tension-driven multichip self-assembly is used for the fabrication of FlexTrateTM. The detailed self-assembly for the FlexTrateTM application is described to precisely and highly integrate heterogeneous dielets embedded in PDMS as a flexible substrate in wafer-level processing.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"13 1","pages":"1836-1841"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Self-Assembly Technologies for FlexTrate™\",\"authors\":\"T. Fukushima, Y. Susumago, H. Kino, Tetsu Tanaka, A. Alam, A. Hanna, S. Iyer\",\"doi\":\"10.1109/ECTC.2018.00275\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed new flexible hybrid electronics (FHE) systems called FlexTrateTM that is high-performance and scalable flexible substrates embedding heterogeneous inorganic monocrystalline semiconductor dielets. In this work, a modified die-first FOWLP technology with surface tension-driven multichip self-assembly is used for the fabrication of FlexTrateTM. The detailed self-assembly for the FlexTrateTM application is described to precisely and highly integrate heterogeneous dielets embedded in PDMS as a flexible substrate in wafer-level processing.\",\"PeriodicalId\":6555,\"journal\":{\"name\":\"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"13 1\",\"pages\":\"1836-1841\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2018.00275\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2018.00275","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We have developed new flexible hybrid electronics (FHE) systems called FlexTrateTM that is high-performance and scalable flexible substrates embedding heterogeneous inorganic monocrystalline semiconductor dielets. In this work, a modified die-first FOWLP technology with surface tension-driven multichip self-assembly is used for the fabrication of FlexTrateTM. The detailed self-assembly for the FlexTrateTM application is described to precisely and highly integrate heterogeneous dielets embedded in PDMS as a flexible substrate in wafer-level processing.
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