2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

查看最新文献

1310

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - 最新文献

Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process

Pub Date : 2018-11-01 DOI: 10.1109/ICSJ.2018.8602655 Wei-chung Chen, C. Lee, H. Kuo, Min-Hua Chung, Chaung-Chi Wang, Shang-Kun Huang, Yen-Sen Liao, Chen-Chao Wang, D. Tarng

A Novel Finite Element Technique for Moisture Diffusion Modeling Using ANSYS

Pub Date : 2018-08-09 DOI: 10.1109/ECTC.2018.00043 C. Diyaroglu, S. Oterkus, E. Oterkus

Mechanical Modelling of High Power Lateral IGBT for LED Driver Applications

Pub Date : 2018-08-09 DOI: 10.1109/ECTC.2018.00210 P. Rajaguru, C. Bailey, Hua Lu, A. Castellazzi, M. Antonini, V. Pathirana, N. Udugampola, F. Udrea, Paul Mitchelson, S. Aldhaher

查看全部

免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。