C. Bundesmann, J. Bauer, A. Finzel, J. Gerlach, W. Knolle, A. Hellmich, R. Synowicki
{"title":"氩离子束溅射沉积氧化铟锡薄膜的性能","authors":"C. Bundesmann, J. Bauer, A. Finzel, J. Gerlach, W. Knolle, A. Hellmich, R. Synowicki","doi":"10.1116/6.0000917","DOIUrl":null,"url":null,"abstract":"Indium tin oxide (ITO) thin films were grown by Ar ion beam sputter deposition under systematic variation of ion energy, geometrical parameters, and O 2 background pressure and characterized with regard to the film thickness, growth rate, crystalline structure, surface roughness, mass density, composition, electrical, and optical properties. The growth rate shows an over-cosine, forward-tilted angular distribution with a maximum, which increases with increasing ion energy, increasing ion incidence angle, and decreasing O 2 background pressure. ITO films were found to be amorphous with a surface roughness of less than 1 nm. Mass density and composition show only small changes with increasing scattering angle. The electrical resistivity behavior in dependence on the process parameters is complex. It is not only driven by the O 2 background pressure but also very much by the scattering angle. The observed behavior can be understood only if competing processes are considered: (i) reduction of the number of oxygen vacancies due to the presence of O 2 background gas and (ii) defect generation and preferential sputtering of oxygen at the surface of the growing films due to the impact of high-energy scattered particles. Even though absolute numbers differ, optical characterization suggests a similar systematics.","PeriodicalId":17571,"journal":{"name":"Journal of Vacuum Science and Technology","volume":"07 1","pages":"033406"},"PeriodicalIF":0.0000,"publicationDate":"2021-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Properties of indium tin oxide thin films grown by Ar ion beam sputter deposition\",\"authors\":\"C. Bundesmann, J. Bauer, A. Finzel, J. Gerlach, W. Knolle, A. Hellmich, R. Synowicki\",\"doi\":\"10.1116/6.0000917\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Indium tin oxide (ITO) thin films were grown by Ar ion beam sputter deposition under systematic variation of ion energy, geometrical parameters, and O 2 background pressure and characterized with regard to the film thickness, growth rate, crystalline structure, surface roughness, mass density, composition, electrical, and optical properties. The growth rate shows an over-cosine, forward-tilted angular distribution with a maximum, which increases with increasing ion energy, increasing ion incidence angle, and decreasing O 2 background pressure. ITO films were found to be amorphous with a surface roughness of less than 1 nm. Mass density and composition show only small changes with increasing scattering angle. The electrical resistivity behavior in dependence on the process parameters is complex. It is not only driven by the O 2 background pressure but also very much by the scattering angle. The observed behavior can be understood only if competing processes are considered: (i) reduction of the number of oxygen vacancies due to the presence of O 2 background gas and (ii) defect generation and preferential sputtering of oxygen at the surface of the growing films due to the impact of high-energy scattered particles. Even though absolute numbers differ, optical characterization suggests a similar systematics.\",\"PeriodicalId\":17571,\"journal\":{\"name\":\"Journal of Vacuum Science and Technology\",\"volume\":\"07 1\",\"pages\":\"033406\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Vacuum Science and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1116/6.0000917\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Vacuum Science and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1116/6.0000917","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Properties of indium tin oxide thin films grown by Ar ion beam sputter deposition
Indium tin oxide (ITO) thin films were grown by Ar ion beam sputter deposition under systematic variation of ion energy, geometrical parameters, and O 2 background pressure and characterized with regard to the film thickness, growth rate, crystalline structure, surface roughness, mass density, composition, electrical, and optical properties. The growth rate shows an over-cosine, forward-tilted angular distribution with a maximum, which increases with increasing ion energy, increasing ion incidence angle, and decreasing O 2 background pressure. ITO films were found to be amorphous with a surface roughness of less than 1 nm. Mass density and composition show only small changes with increasing scattering angle. The electrical resistivity behavior in dependence on the process parameters is complex. It is not only driven by the O 2 background pressure but also very much by the scattering angle. The observed behavior can be understood only if competing processes are considered: (i) reduction of the number of oxygen vacancies due to the presence of O 2 background gas and (ii) defect generation and preferential sputtering of oxygen at the surface of the growing films due to the impact of high-energy scattered particles. Even though absolute numbers differ, optical characterization suggests a similar systematics.