{"title":"新型光刻技术提高先进包装制造的分辨率极限","authors":"H. Matsui","doi":"10.4071/1085-8024-2021.1.000045","DOIUrl":null,"url":null,"abstract":"\n New lithography method will be proposed in the paper to enhance resolution limit by half of current one while keeping depth of focus at the same value. The method is based on lithography and copper plating process in order to be applicable to advanced packaging manufacturing.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"65 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel lithography technology for enhancing resolution limit at advanced packaging manufacturing\",\"authors\":\"H. Matsui\",\"doi\":\"10.4071/1085-8024-2021.1.000045\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n New lithography method will be proposed in the paper to enhance resolution limit by half of current one while keeping depth of focus at the same value. The method is based on lithography and copper plating process in order to be applicable to advanced packaging manufacturing.\",\"PeriodicalId\":14363,\"journal\":{\"name\":\"International Symposium on Microelectronics\",\"volume\":\"65 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/1085-8024-2021.1.000045\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000045","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel lithography technology for enhancing resolution limit at advanced packaging manufacturing
New lithography method will be proposed in the paper to enhance resolution limit by half of current one while keeping depth of focus at the same value. The method is based on lithography and copper plating process in order to be applicable to advanced packaging manufacturing.
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