采用渐变通道掺杂技术提高无结纳米级DG MOSFET的可靠性性能

T. Bentrcia, F. Djeffal, D. Arar, Elasaad Chebaki
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引用次数: 1

摘要

在过去的几年里,纳米电路小型化的趋势加速发展。事实上,这已经在多栅极结构(如通道体或栅极材料)的不同层次上得到了许多改进。我们在这项工作的目的是研究无结DG MOSFET的可靠性性能,包括梯度通道方面。使用ATLAS-2D模拟器对所考虑的器件的行为进行了数值分析,其中模型中考虑了退化现象。一些模拟/射频标准的变化,即跨导和截止频率,是根据信道长度和陷阱密度建立的。得到的响应表明,与传统结构相比,梯度通道器件对陷阱诱导的退化具有更好的免疫能力。因此,这项工作可以为未来纳米级电子应用中采用通道掺杂工程的好处提供更多的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improved Reliability Performance of Junctionless Nanoscale DG MOSFET with Graded Channel Doping Engineering
In the last few years, an accelerated trend toward the miniaturization of nanoscale circuits has been recorded. In fact, this has been reflected by numerous enhancements at different levels of multi-gate structures such as the channel body or the gate material. Our aim in this work is to investigate the reliability performance of junctionless DG MOSFET including graded channel aspect. The behavior of the considered device is analyzed numerically using ATLAS-2D simulator, where degradation phenomena are accounted for in the model. The variation of some analog/RF criteria namely the transconductance and cut-off frequency are established in terms of the channel length and traps density. The obtained responses indicate the superior immunity of the graded channel device against traps-induced degradation in comparison to the conventional structure. Thus, this work can offer more insights regarding the benefit of adopting the channel doping engineering for future nanoscale electronic applications.
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