{"title":"银焊丝包解封装过程中银腐蚀速率的降低","authors":"Young-Ja Kim, Jinho Hah, K. Moon, C. Wong","doi":"10.1109/ECTC.2019.00325","DOIUrl":null,"url":null,"abstract":"Ag wire-bonded packages have gained a lot of interest as a low-cost substitute material in lieu of Au wire-bonded packages. However, selective decapsulation still remains as challenges due to a corrosion on Ag wires, where Ag has a strong tendency to form a water-soluble Ag salt upon reaction with a conventional nitric acid etchant. This paper serves to present a chemical solution that can reduce corrosion on Ag wires during decapsulation process of the Ag wire-bonded packages. Also, our method is applicable for industry standard needs such as for decapsulation at high temperature.","PeriodicalId":6726,"journal":{"name":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","volume":"65 1","pages":"2359-2364"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Reduction of Ag Corrosion Rate During Decapsulation of Ag Wire Bond Packages\",\"authors\":\"Young-Ja Kim, Jinho Hah, K. Moon, C. Wong\",\"doi\":\"10.1109/ECTC.2019.00325\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Ag wire-bonded packages have gained a lot of interest as a low-cost substitute material in lieu of Au wire-bonded packages. However, selective decapsulation still remains as challenges due to a corrosion on Ag wires, where Ag has a strong tendency to form a water-soluble Ag salt upon reaction with a conventional nitric acid etchant. This paper serves to present a chemical solution that can reduce corrosion on Ag wires during decapsulation process of the Ag wire-bonded packages. Also, our method is applicable for industry standard needs such as for decapsulation at high temperature.\",\"PeriodicalId\":6726,\"journal\":{\"name\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"65 1\",\"pages\":\"2359-2364\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2019.00325\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2019.00325","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reduction of Ag Corrosion Rate During Decapsulation of Ag Wire Bond Packages
Ag wire-bonded packages have gained a lot of interest as a low-cost substitute material in lieu of Au wire-bonded packages. However, selective decapsulation still remains as challenges due to a corrosion on Ag wires, where Ag has a strong tendency to form a water-soluble Ag salt upon reaction with a conventional nitric acid etchant. This paper serves to present a chemical solution that can reduce corrosion on Ag wires during decapsulation process of the Ag wire-bonded packages. Also, our method is applicable for industry standard needs such as for decapsulation at high temperature.
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