微电子制造中控制表面敏感过程以提高焊丝连接的可靠性

E. Kidd, B. Campbell, R. Dillingham
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引用次数: 0

摘要

验证模垫表面的化学成分和性能对于实现微电子线键合操作中的连接可靠性至关重要。在粘合之前,模具垫表面经历了许多表面敏感的制造步骤,这将影响接头的性能;来自工艺助剂、运输、处理、储存和出厂时间的接触和环境污染物都是表面降解的关键因素。微电子制造商可能会实施清洁和/或表面活化操作来修复上游污染物的表面,然而,了解和量化这些过程的效果需要能够操纵和监测材料表面粘附的前几个分子层。本报告将通过x射线光电子能谱(XPS)和通过接触角技术测量表面能来研究大气等离子体清洁和未清洁的模垫表面的表面化学成分。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Controlling Surface Sensitive Processes in Microelectronics Manufacturing to Improve Wire Bonded Joint Reliability
Validating surface chemical composition and properties of die pad surfaces is crucial for achieving joint reliability in microelectronic wire bonding operations. Die pad surfaces undergo a number of surface sensitive manufacturing steps prior to bonding that will affect joint performance; contact and environmental contaminants from process aids, shipping, handling, storage and out time are all key players in surface degradation. Microelectronics manufacturers may implement cleaning and/or surface activation operations to remediate surfaces from upstream contaminants, however, understanding and quantifying the effect of such processes requires the ability to manipulate and monitor the top few molecular layers of a material responsible for adhesion—the surface. This presentation will investigate surface chemistries of atmospheric plasma cleaned and non-cleaned die pad surfaces as determined by X-ray photoelectron spectroscopy (XPS) and surface energy measurements via contact angle techniques.
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