BA-BIST:从IC内到外的电路板测试

2013 IEEE International Test Conference (ITC) Pub Date : 2013-11-04 DOI:10.1109/TEST.2013.6651919

Z. Conroy, A. Crouch

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引用次数: 2

摘要

随着pcb的几何尺寸不断缩小，接口速度不断提高，以及相应的用于诊断结构测试缺陷的测试点访问损失，需要新的标准测试机制来测试片对片的连接性和板级功能。将提出对集成电路“BA”(Board-Assist) BIST进行结构测试的新要求。提出了行业杠杆的标准化BA-BIST模板和算法。

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BA-BIST: Board test from inside the IC out

With shrinking geometries of PCBs, increasing interface speeds and corresponding loss of test point access to diagnose structural test defects, new standard test mechanisms are needed to test chip-to-chip connectivity and functionality at the board level. New requirements for an integrated circuit `BA' (Board-Assist) BIST to structurally test these interfaces will be presented. A standardized BA-BIST template and algorithms for industry leverage are proposed.

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2013 IEEE International Test Conference (ITC)

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