片上ESD监视器

Kannan Kalappurakal Thankappan, Boris Vaisband, S. Iyer
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引用次数: 2

摘要

静电放电(ESD)故障导致了大约35%的IC领域退货,并给半导体行业造成了数十亿美元的损失。片上ESD检测器可以帮助跟踪ic从制造到寿命结束的静电历史。提出了两种片上ESD检测方法:变介电宽电容和垂直MOSCAP阵列。可变介电宽电容器方法采用端部有尖角的金属板,以增强局部电场,使金属板之间的薄介电易于击穿。垂直MOSCAP阵列由串联的电容阵列组成。这两种方法都在GlobalFoundries公司的22纳米全贫硅绝缘体上进行了模拟、制造和实验表征。垂直MOSCAP阵列以6V粒度检测~ 6V起的ESD事件,而可变介电宽电容则适用于检测40 V及以上的高ESD电压。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On-Chip ESD Monitor
Electrostatic discharge (ESD) failure results in about 35% of IC field returns, and is the cause of several billiondollar loss to the semiconductor industry. An on-chip ESD detector can help track the electrostatic history of ICs from manufacturing to end-of-life. Two approaches for on-chip ESD detection are presented: variable dielectric width capacitor, and vertical MOSCAP array. The variable dielectric width capacitor approach employs metal plates terminated with sharp corners to enhance local electric field and facilitate easy breakdown of the thin dielectric between the metal plates. The vertical MOSCAP array consists of a capacitor array connected in series. Both approaches were simulated, fabricated, and experimentally characterized in GlobalFoundries 22 nm fully depleted silicon-oninsulator. Vertical MOSCAP arrays detect ESD events starting from ~6 V with 6V granularity, while the variable dielectric width capacitor is suitable for detection of high ESD voltage from 40 V and above.
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