一种计算效率高的离子注入损伤模型及其在多离子注入模拟中的应用

G. Wang, S. Tian, M. Morris, B. Obradovic, G. Balamurugan, A. Tasch, S. Morris, H. Kennel, P. Packan, C. Magee, J. Sheng, R. Lowther, J. Linn, C. Snell
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引用次数: 2

摘要

最近,UT-MARLOWE开发并实现了计算效率高的离子注入累积损伤模型4.0和4.1。该模型基于修正的Kinchin-Pease公式,简化了损伤的产生和积累、缺陷的遭遇和非晶化。结果表明,单晶硅中As、B、BF2和P的掺杂谱与实验结果吻合较好。此外,该模型得到的非晶层厚度也与实验测量值吻合较好。基于该损伤模型,开发了一种简单但功能强大且通用的多种植体模拟方法,与实验数据吻合良好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A computationally efficient ion implantation damage model and its application to multiple implant simulations
A computationally efficient ion implantation cumulative damage model has recently been developed and implemented in UT-MARLOWE Versions 4.0 and 4.1. Based on the modified Kinchin-Pease formula, this model accounts for damage generation and accumulation, defect encounters and amorphization in a simplified way. Good agreement with experimental impurity profiles has been obtained for As, B, BF2 and P implants in single-crystal silicon. In addition, the amorphous layer thicknesses obtained in this model are also in reasonable agreement with experimental measurements. Based on this damage model, a simple but extremely powerful and general method for performing multiple implant simulations has been developed, and very good agreement with experimental data has been obtained.
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