嵌入式薄膜电阻材料的加工技术

2011 International Symposium on Advanced Packaging Materials (APM) Pub Date : 2011-12-19 DOI:10.1109/ISAPM.2011.6105671

Lifei Lai, R. Sun, T. Zhao, Xiaoliang Zeng, Shuhui Yu

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引用次数: 7

摘要

嵌入式薄膜电阻器(ETFR)材料的研究在国内还比较少见。本文叙述了ETFR的发展历史和现状，叙述了整个工艺技术，揭示了国内产品的迫切性，介绍了我们所研究的Ni-Cr (80/ 20wt .%) ETFR材料的热稳定性和微观特性，并对可能的开发应用进行了初步探讨。

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Processing technology of embedded thin-film resistor materials

It is relatively rare for us to research Embedded Thin-Film Resistor (ETFR) Materials in domestic. This paper describes the development history and present situation of the ETFR, the whole process technology is told, the urgency of domestic products is revealed, the thermal stability and microscopic characteristics of the Ni-Cr (80/20 wt.%) ETFR material that we have researched are introduced, the possible development and application is also tentatively discussed.

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2011 International Symposium on Advanced Packaging Materials (APM)

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