N3中埋电SRAM DTCO和系统级基准测试

S. Salahuddin, M. Perumkunnil, E. Litta, A. Gupta, P. Weckx, J. Ryckaert, M. Na, A. Spessot
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引用次数: 8

摘要

增加的金属电阻降低了SRAM电路在亚10nm节点上的性能和写入裕度。本文利用埋地功率分布作为SRAM性能和3nm节点写入能力的增强器。与传统SRAM相比,BPR-SRAM提供高达34.5%的读取速度和498.6mV的写入裕度改进。Gem5系统模拟器预测,与基线相比,在L2和L3缓存中具有BPR-SRAM的服务器处理器可以获得高达28.2%的性能增益。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Buried power SRAM DTCO and system-level benchmarking in N3
The increased metal resistance degrades both the performance and write margin of SRAM circuits in sub-10nm nodes. This paper utilizes buried power distribution as SRAM performance and write ability booster in 3nm node. BPR-SRAM offers up to 34.5% read speed and 498.6mV write margin improvement over conventional SRAM. Gem5 system simulator predicts up to 28.2% performance gain with server-processor having BPR-SRAM in L2 and L3 cache as compared to the baseline.
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