基于氧化铪薄膜的热释电CMOS兼容传感器元件

C. Mart, A. Viegas, S. Eßlinger, M. Czernohorsky, W. Weinreich, D. Mutschall, A. Kaiser, N. Neumann, T. Großmann, K. Hiller, L. Eng
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引用次数: 3

摘要

纳米薄的铁电氧化铪(HfO2)薄膜能够在CMOS兼容工艺中制造集成红外传感器。通过将热释电薄膜沉积在面积增强的衬底上,我们将传感器元件的响应显著提高了12倍以上。评估了掺杂HfO2在三维结构中的集成挑战,并比较了si掺杂材料和Hf0.5Zr0.5O2混合氧化物的热释电信号幅度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Pyroelectric CMOS Compatible Sensor Element Based on Hafnium Oxide Thin Films
Nanometer-thin ferroelectric hafnium oxide (HfO2) films enable manufacturing of integrated infrared sensors in a CMOS compatible process. By depositing the pyroelectric film on an area-enhanced substrate, we significantly improve the sensor element response by a factor of more than 12. Integration challenges of doped HfO2 in 3D structures are assessed, and the pyroelectric signal amplitude is compared for Si-doped material and the Hf0.5Zr0.5O2 mixed oxide.
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