会议联席主席吴安烨致欢迎辞

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382219

A. Wu

{"title":"会议联席主席吴安烨致欢迎辞","authors":"A. Wu","doi":"10.1109/IMPACT.2009.5382219","DOIUrl":null,"url":null,"abstract":"Thank you for participating in IMPACT Conference 2009 and International 3D IC Conference. Due to the trend of 3D IC technology and development are discussed popularly in the world; SIPO especially holds this joint conference with IMPACT to introduce more about 3D IC technology in this conference.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"43 1","pages":"1-1"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Welcome message from An-Yeu Wu, conference co-chair\",\"authors\":\"A. Wu\",\"doi\":\"10.1109/IMPACT.2009.5382219\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thank you for participating in IMPACT Conference 2009 and International 3D IC Conference. Due to the trend of 3D IC technology and development are discussed popularly in the world; SIPO especially holds this joint conference with IMPACT to introduce more about 3D IC technology in this conference.\",\"PeriodicalId\":6410,\"journal\":{\"name\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"volume\":\"43 1\",\"pages\":\"1-1\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMPACT.2009.5382219\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382219","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

感谢您参加IMPACT会议2009及国际3D集成电路会议。由于三维集成电路技术的发展趋势，在世界范围内得到了广泛的讨论;国家知识产权局特别与IMPACT举办了这次联合会议，在会议上介绍更多3D集成电路技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Welcome message from An-Yeu Wu, conference co-chair

Thank you for participating in IMPACT Conference 2009 and International 3D IC Conference. Due to the trend of 3D IC technology and development are discussed popularly in the world; SIPO especially holds this joint conference with IMPACT to introduce more about 3D IC technology in this conference.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

自引率

0.00%

发文量