同步多色x射线Laue微衍射研究了30 μm细间距Sn2.5Ag微凸起的择优取向

T. Tian, Kai Chen, Martin Kunz, Nobumichi Tamura, C. Zhan, Tao-Chih Chang, K. Tu
{"title":"同步多色x射线Laue微衍射研究了30 μm细间距Sn2.5Ag微凸起的择优取向","authors":"T. Tian, Kai Chen, Martin Kunz, Nobumichi Tamura, C. Zhan, Tao-Chih Chang, K. Tu","doi":"10.1109/ECTC.2012.6248938","DOIUrl":null,"url":null,"abstract":"Synchrotron radiation white beam x-ray microdiffraction was employed to study grain size and orientation of fine pitch Sn2.5Ag micro-bumps. The indexing of the Laue patterns shows that there is mostly one dominant grain orientation in each micro-bump. Moreover, a statistics study based on the characterization of 72 micro-bumps, shows that the [001] direction, which is the fast diffusion path for Ni/Cu atoms in Sn tends to be parallel to the substrate of the test vehicle. This property remains stable after repeated reflow processes.","PeriodicalId":6384,"journal":{"name":"2012 IEEE 62nd Electronic Components and Technology Conference","volume":"53 1","pages":"882-885"},"PeriodicalIF":0.0000,"publicationDate":"2012-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Preferred orientation of 30 μm fine pitch Sn2.5Ag micro-bumps studied by synchrotron polychromatic x-ray Laue microdiffraction\",\"authors\":\"T. Tian, Kai Chen, Martin Kunz, Nobumichi Tamura, C. Zhan, Tao-Chih Chang, K. Tu\",\"doi\":\"10.1109/ECTC.2012.6248938\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Synchrotron radiation white beam x-ray microdiffraction was employed to study grain size and orientation of fine pitch Sn2.5Ag micro-bumps. The indexing of the Laue patterns shows that there is mostly one dominant grain orientation in each micro-bump. Moreover, a statistics study based on the characterization of 72 micro-bumps, shows that the [001] direction, which is the fast diffusion path for Ni/Cu atoms in Sn tends to be parallel to the substrate of the test vehicle. This property remains stable after repeated reflow processes.\",\"PeriodicalId\":6384,\"journal\":{\"name\":\"2012 IEEE 62nd Electronic Components and Technology Conference\",\"volume\":\"53 1\",\"pages\":\"882-885\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-07-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 62nd Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2012.6248938\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 62nd Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2012.6248938","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

采用同步辐射白束x射线微衍射研究了Sn2.5Ag微凸起的晶粒尺寸和取向。Laue模式的标度分析表明,每个微凸起中几乎都有一个主要的晶粒取向。此外,基于72个微碰撞特征的统计研究表明,[001]方向是Ni/Cu原子在Sn中的快速扩散路径,趋向于平行于试验车辆的衬底。该特性在重复回流过程后保持稳定。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preferred orientation of 30 μm fine pitch Sn2.5Ag micro-bumps studied by synchrotron polychromatic x-ray Laue microdiffraction
Synchrotron radiation white beam x-ray microdiffraction was employed to study grain size and orientation of fine pitch Sn2.5Ag micro-bumps. The indexing of the Laue patterns shows that there is mostly one dominant grain orientation in each micro-bump. Moreover, a statistics study based on the characterization of 72 micro-bumps, shows that the [001] direction, which is the fast diffusion path for Ni/Cu atoms in Sn tends to be parallel to the substrate of the test vehicle. This property remains stable after repeated reflow processes.
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