S. Murali, L. Wan, Dhayalan Mariyappan, Lim Yee Weon Evonne, Kang Sungsig SS
{"title":"自由空气球(FAB)表面金属涂层的分布","authors":"S. Murali, L. Wan, Dhayalan Mariyappan, Lim Yee Weon Evonne, Kang Sungsig SS","doi":"10.4071/1085-8024-2021.1.000328","DOIUrl":null,"url":null,"abstract":"\n Developments in bonding wire focus on coated silver wire for stacked devices in memory sectors revealing near equivalent performances to 4N Au wire. In addition to stacked device applications, the wire is also examined for other conventional applications. The innovative wire exhibits excellent performance on biased Highly Accelerated Stress Test (bHAST) passing 192h and 504h at 130°C, 85%RH for +3.3V and +20V, respectively. Thus, the wire satisfied one of the important criteria required to pass automotive reliability test (2X stress test, AEC Q100 Rev-H, with limited test samples). The test is conducted using 0.8mil coated silver wire and molded with green epoxy molding compound. Another benefit of the wire is stitch bond bondability with high MTBA of greater than 2h.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"56 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Distribution of Coated Metal Layer on Free Air Ball (FAB) Surface\",\"authors\":\"S. Murali, L. Wan, Dhayalan Mariyappan, Lim Yee Weon Evonne, Kang Sungsig SS\",\"doi\":\"10.4071/1085-8024-2021.1.000328\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Developments in bonding wire focus on coated silver wire for stacked devices in memory sectors revealing near equivalent performances to 4N Au wire. In addition to stacked device applications, the wire is also examined for other conventional applications. The innovative wire exhibits excellent performance on biased Highly Accelerated Stress Test (bHAST) passing 192h and 504h at 130°C, 85%RH for +3.3V and +20V, respectively. Thus, the wire satisfied one of the important criteria required to pass automotive reliability test (2X stress test, AEC Q100 Rev-H, with limited test samples). The test is conducted using 0.8mil coated silver wire and molded with green epoxy molding compound. Another benefit of the wire is stitch bond bondability with high MTBA of greater than 2h.\",\"PeriodicalId\":14363,\"journal\":{\"name\":\"International Symposium on Microelectronics\",\"volume\":\"56 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/1085-8024-2021.1.000328\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000328","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Distribution of Coated Metal Layer on Free Air Ball (FAB) Surface
Developments in bonding wire focus on coated silver wire for stacked devices in memory sectors revealing near equivalent performances to 4N Au wire. In addition to stacked device applications, the wire is also examined for other conventional applications. The innovative wire exhibits excellent performance on biased Highly Accelerated Stress Test (bHAST) passing 192h and 504h at 130°C, 85%RH for +3.3V and +20V, respectively. Thus, the wire satisfied one of the important criteria required to pass automotive reliability test (2X stress test, AEC Q100 Rev-H, with limited test samples). The test is conducted using 0.8mil coated silver wire and molded with green epoxy molding compound. Another benefit of the wire is stitch bond bondability with high MTBA of greater than 2h.