{"title":"低碳足迹的数字双驱动产品可持续设计","authors":"Bin He, Hangyu Mao","doi":"10.1115/1.4062427","DOIUrl":null,"url":null,"abstract":"\n Product sustainability is a pressing global issue that requires urgent improvement, and low-carbon design is a crucial approach towards achieving sustainable product development. Digital twin technology, which connects the physical and virtual worlds, has emerged as an effective tool for supporting product design and development. However, obtaining accurate product parameters remains a challenge, and traditional low-carbon product design primarily focuses on design parameters. To address these issues, this paper proposes a method for data collection throughout the product lifecycle, leveraging the Internet of Things. The paper envisions the automatic collection of product lifecycle data to enhance the accuracy of product design. Moreover, traditional low-carbon design often has a limited scope that primarily considers product structure and lifecycle stage for optimization. In contrast, combining digital twin technology with low-carbon design can effectively improve product sustainability. Therefore, this paper proposes a three-layer architecture model of product sustainability digital twin, comprising data layer, mapping layer, and application layer. This model sets the carbon footprint as the iterative optimization goal and facilitates the closed-loop sustainable design of the product. The paper envisions sustainable product design based on digital twins that can address cascading problems and achieve closed-loop sustainable design.","PeriodicalId":54856,"journal":{"name":"Journal of Computing and Information Science in Engineering","volume":"56 1","pages":""},"PeriodicalIF":2.6000,"publicationDate":"2023-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Digital Twin-Driven Product Sustainable Design for Low Carbon Footprint\",\"authors\":\"Bin He, Hangyu Mao\",\"doi\":\"10.1115/1.4062427\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Product sustainability is a pressing global issue that requires urgent improvement, and low-carbon design is a crucial approach towards achieving sustainable product development. Digital twin technology, which connects the physical and virtual worlds, has emerged as an effective tool for supporting product design and development. However, obtaining accurate product parameters remains a challenge, and traditional low-carbon product design primarily focuses on design parameters. To address these issues, this paper proposes a method for data collection throughout the product lifecycle, leveraging the Internet of Things. The paper envisions the automatic collection of product lifecycle data to enhance the accuracy of product design. Moreover, traditional low-carbon design often has a limited scope that primarily considers product structure and lifecycle stage for optimization. In contrast, combining digital twin technology with low-carbon design can effectively improve product sustainability. Therefore, this paper proposes a three-layer architecture model of product sustainability digital twin, comprising data layer, mapping layer, and application layer. This model sets the carbon footprint as the iterative optimization goal and facilitates the closed-loop sustainable design of the product. The paper envisions sustainable product design based on digital twins that can address cascading problems and achieve closed-loop sustainable design.\",\"PeriodicalId\":54856,\"journal\":{\"name\":\"Journal of Computing and Information Science in Engineering\",\"volume\":\"56 1\",\"pages\":\"\"},\"PeriodicalIF\":2.6000,\"publicationDate\":\"2023-04-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Computing and Information Science in Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4062427\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Computing and Information Science in Engineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4062427","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS","Score":null,"Total":0}
Digital Twin-Driven Product Sustainable Design for Low Carbon Footprint
Product sustainability is a pressing global issue that requires urgent improvement, and low-carbon design is a crucial approach towards achieving sustainable product development. Digital twin technology, which connects the physical and virtual worlds, has emerged as an effective tool for supporting product design and development. However, obtaining accurate product parameters remains a challenge, and traditional low-carbon product design primarily focuses on design parameters. To address these issues, this paper proposes a method for data collection throughout the product lifecycle, leveraging the Internet of Things. The paper envisions the automatic collection of product lifecycle data to enhance the accuracy of product design. Moreover, traditional low-carbon design often has a limited scope that primarily considers product structure and lifecycle stage for optimization. In contrast, combining digital twin technology with low-carbon design can effectively improve product sustainability. Therefore, this paper proposes a three-layer architecture model of product sustainability digital twin, comprising data layer, mapping layer, and application layer. This model sets the carbon footprint as the iterative optimization goal and facilitates the closed-loop sustainable design of the product. The paper envisions sustainable product design based on digital twins that can address cascading problems and achieve closed-loop sustainable design.
期刊介绍:
The ASME Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to Algorithms, Computational Methods, Computing Infrastructure, Computer-Interpretable Representations, Human-Computer Interfaces, Information Science, and/or System Architectures that aim to improve some aspect of product and system lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, recycling etc.). Applications considered in JCISE manuscripts should be relevant to the mechanical engineering discipline. Papers can be focused on fundamental research leading to new methods, or adaptation of existing methods for new applications.
Scope: Advanced Computing Infrastructure; Artificial Intelligence; Big Data and Analytics; Collaborative Design; Computer Aided Design; Computer Aided Engineering; Computer Aided Manufacturing; Computational Foundations for Additive Manufacturing; Computational Foundations for Engineering Optimization; Computational Geometry; Computational Metrology; Computational Synthesis; Conceptual Design; Cybermanufacturing; Cyber Physical Security for Factories; Cyber Physical System Design and Operation; Data-Driven Engineering Applications; Engineering Informatics; Geometric Reasoning; GPU Computing for Design and Manufacturing; Human Computer Interfaces/Interactions; Industrial Internet of Things; Knowledge Engineering; Information Management; Inverse Methods for Engineering Applications; Machine Learning for Engineering Applications; Manufacturing Planning; Manufacturing Automation; Model-based Systems Engineering; Multiphysics Modeling and Simulation; Multiscale Modeling and Simulation; Multidisciplinary Optimization; Physics-Based Simulations; Process Modeling for Engineering Applications; Qualification, Verification and Validation of Computational Models; Symbolic Computing for Engineering Applications; Tolerance Modeling; Topology and Shape Optimization; Virtual and Augmented Reality Environments; Virtual Prototyping