{"title":"封装电感对毫米波功率放大器稳定性的影响","authors":"Y. Jeon, R. Kumarasamy","doi":"10.1109/EPTC50525.2020.9315069","DOIUrl":null,"url":null,"abstract":"It is known that mm-Wave power amplifiers can suffer from deterioration of power gain and efficiency due to package parasitic. This paper addresses specifically the impact of package inductances on the stability. Two methods are suggested to improve the stability, which are adoption of wide-band RC networks and splitting power supplies and grounds for multi-stage amplifiers.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"84 1","pages":"255-256"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Impact of Package Inductance on Stability of mm-Wave Power Amplifiers\",\"authors\":\"Y. Jeon, R. Kumarasamy\",\"doi\":\"10.1109/EPTC50525.2020.9315069\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is known that mm-Wave power amplifiers can suffer from deterioration of power gain and efficiency due to package parasitic. This paper addresses specifically the impact of package inductances on the stability. Two methods are suggested to improve the stability, which are adoption of wide-band RC networks and splitting power supplies and grounds for multi-stage amplifiers.\",\"PeriodicalId\":6790,\"journal\":{\"name\":\"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"84 1\",\"pages\":\"255-256\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC50525.2020.9315069\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC50525.2020.9315069","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Impact of Package Inductance on Stability of mm-Wave Power Amplifiers
It is known that mm-Wave power amplifiers can suffer from deterioration of power gain and efficiency due to package parasitic. This paper addresses specifically the impact of package inductances on the stability. Two methods are suggested to improve the stability, which are adoption of wide-band RC networks and splitting power supplies and grounds for multi-stage amplifiers.
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