可折叠电路的微型多功能智能数字粉尘传感器

Chip Pub Date : 2022-12-01 DOI:10.1016/j.chip.2022.100034
Chun-Yu You , Bo-Fan Hu , Bo-Rui Xu , Zi-Yu Zhang , Bin-Min Wu , Gao-Shan Huang , En-Ming Song , Yong-Feng Mei
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引用次数: 2

摘要

智能粉尘指的是小型化、多功能的传感器微粒,它将为物联网(IoT)和环境保护应用开辟数据采集机会。然而,在高密度传感器的集成、设备平台的进一步小型化和降低成本方面,仍然存在着关键的障碍。在这里,我们展示了智能数字粉尘的概念来解决这些问题,其结果结合了(i)互补金属氧化物半导体(CMOS)处理方法的成熟度和(ii)新兴柔性电子产品的独特外形因素的好处。作为智能数字粉尘的原型,我们提出了一个毫米级多功能光电传感器平台,该平台由高性能光电传感器核心和市售集成电路组件组成。该智能材料辅助光电传感机制基于超低功耗的单芯片实现实时、高灵敏度的氢气、温度和相对湿度(RH)传感。这里介绍的这种微系统为物联网的多功能传感需求提供了可行的解决方案,可以作为快速发展的未来智能粉尘框架的基石。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Foldable-circuit-enabled miniaturized multifunctional sensor for smart digital dust

Smart dust, which refers to miniaturized, multifunctional sensor motes, would open up data acquisition opportunities for Internet of Things (IoT) and Environmental protection applications. However, critical obstacles remain challenging in the integration of high-density sensors, further miniaturization of device platforms, and reduction of cost. Here, we demonstrate the concept of smart digital dust to address these problems, the results of which combine the benefit of (i) maturity of complementary metal-oxide semiconductor (CMOS) processing approaches and (ii) unique form factors of emerging flexible electronics. As a prototype for smart digital dust, we present a millimeter-scale multifunctional optoelectronic sensor platform consisting of high-performance optoelectronic sensor cores and commercially available integrated-circuit components. The smart material-assisted optoelectronic sensing mechanism enables real-time, high-sensitivity hydrogen, temperature, and relative humidity (RH) sensing based on a single chip with ultralow power consumption. Such a microsystem presented here introduces a viable solution to the multifunctional sensing need of IoT and could serve as a building block for the rapidly evolving future framework of smart dust.

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