{"title":"2.5D/3D应用的临时绑定和解绑定过程","authors":"Qin Ren, W. Loh, S. K. Neo, K. Chui","doi":"10.1109/EPTC50525.2020.9315033","DOIUrl":null,"url":null,"abstract":"Temporary bonding and de-bonding (TBDB) is one key technology in enabling the 2.5D/3D integration of semiconductor devices [1]. In this paper, we first evaluate two TBDB methods using different TBDB mechanism and corresponding adhesive materials, in particular for via-last Through Silicon Via (TSV) process. We compare a solvent-based TBDB method [2], [3] with another mechanical-based TBDB method. The second part of this paper analyze the process issues and root causes related to each TBDB methodology. Continuous improvement will need to rely on TBDB material and process development as well as integration optimization.","PeriodicalId":6790,"journal":{"name":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","volume":"45 1","pages":"27-31"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Temporary Bonding and De-bonding Process for 2.5D/3D Applications\",\"authors\":\"Qin Ren, W. Loh, S. K. Neo, K. Chui\",\"doi\":\"10.1109/EPTC50525.2020.9315033\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Temporary bonding and de-bonding (TBDB) is one key technology in enabling the 2.5D/3D integration of semiconductor devices [1]. In this paper, we first evaluate two TBDB methods using different TBDB mechanism and corresponding adhesive materials, in particular for via-last Through Silicon Via (TSV) process. We compare a solvent-based TBDB method [2], [3] with another mechanical-based TBDB method. The second part of this paper analyze the process issues and root causes related to each TBDB methodology. Continuous improvement will need to rely on TBDB material and process development as well as integration optimization.\",\"PeriodicalId\":6790,\"journal\":{\"name\":\"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"45 1\",\"pages\":\"27-31\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC50525.2020.9315033\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC50525.2020.9315033","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temporary Bonding and De-bonding Process for 2.5D/3D Applications
Temporary bonding and de-bonding (TBDB) is one key technology in enabling the 2.5D/3D integration of semiconductor devices [1]. In this paper, we first evaluate two TBDB methods using different TBDB mechanism and corresponding adhesive materials, in particular for via-last Through Silicon Via (TSV) process. We compare a solvent-based TBDB method [2], [3] with another mechanical-based TBDB method. The second part of this paper analyze the process issues and root causes related to each TBDB methodology. Continuous improvement will need to rely on TBDB material and process development as well as integration optimization.