{"title":"用于高级包装的高紫外线透射玻璃载体","authors":"Jay Zhang, Indy Dutta, J. Brueckner, Katsumi Bono","doi":"10.4071/1085-8024-2021.1.000103","DOIUrl":null,"url":null,"abstract":"\n Glass carrier wafers are used in many temporary bonding and debonding applications such as wafer thinning and fan-out wafer level packaging. For light-based debonding, a UV light source is often chosen for one or more of the following reasons: limiting light penetration into the sensitive die area; providing uniform light beam energy distribution; minimizing heat problems; maximizing overall process throughput. Corning has recently developed high UV transmission glass carrier wafers in response to market demand. In this paper, we will discuss the benefits of using such glass wafers for 308nm excimer laser debonding as well as a shorter wavelength UV lamp debonding cases.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"27 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High UV Transmission Glass Carriers for Advanced Packaging\",\"authors\":\"Jay Zhang, Indy Dutta, J. Brueckner, Katsumi Bono\",\"doi\":\"10.4071/1085-8024-2021.1.000103\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Glass carrier wafers are used in many temporary bonding and debonding applications such as wafer thinning and fan-out wafer level packaging. For light-based debonding, a UV light source is often chosen for one or more of the following reasons: limiting light penetration into the sensitive die area; providing uniform light beam energy distribution; minimizing heat problems; maximizing overall process throughput. Corning has recently developed high UV transmission glass carrier wafers in response to market demand. In this paper, we will discuss the benefits of using such glass wafers for 308nm excimer laser debonding as well as a shorter wavelength UV lamp debonding cases.\",\"PeriodicalId\":14363,\"journal\":{\"name\":\"International Symposium on Microelectronics\",\"volume\":\"27 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/1085-8024-2021.1.000103\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000103","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High UV Transmission Glass Carriers for Advanced Packaging
Glass carrier wafers are used in many temporary bonding and debonding applications such as wafer thinning and fan-out wafer level packaging. For light-based debonding, a UV light source is often chosen for one or more of the following reasons: limiting light penetration into the sensitive die area; providing uniform light beam energy distribution; minimizing heat problems; maximizing overall process throughput. Corning has recently developed high UV transmission glass carrier wafers in response to market demand. In this paper, we will discuss the benefits of using such glass wafers for 308nm excimer laser debonding as well as a shorter wavelength UV lamp debonding cases.
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