千兆级集成(GSI)的互连设备机会

International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224) Pub Date : 2001-12-02 DOI:10.1109/IEDM.2001.979560

J. Meindl, R. Venkatesan, J.A. Davis, J. Joyner, A. Naeemi, P. Zarkesh-Ha, M. Bakir, T. Mule, P. Kohl, K. Martin

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引用次数: 39

摘要

近年来，互连器件已成为千兆级集成(GSI)性能、能量消耗、信号完整性和生产力的主要限制。解决互连问题的机会包括新材料和工艺，反向缩放，新型微架构，三维集成，输入/输出互连增强，射频无线互连和微光子学。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Interconnecting device opportunities for gigascale integration (GSI)

In recent years interconnecting devices have become primary limits on the performance, energy dissipation, signal integrity, and productivity of gigascale integration (GSI). Opportunities to address the interconnect problem include new materials and processes, reverse scaling, novel microarchitectures, three-dimensional integration, input/output interconnect enhancements, RF wireless interconnects and microphotonics.

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International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)

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