一种用于医疗设备的新型封装热管理方法

Nu Bich Duyen Do, E. Andreassen, K. Imenes
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引用次数: 1

摘要

本文介绍了一种介入性医疗装置的封装研究,用于暂时在人食管内进行心脏成像。金属化聚合物封装是一种简化器件组装的潜在封装方法,在热性能方面进行了实验评估。采用3D打印后电镀的方法制作封装。采用双层封装的简化模型的表面温度在模拟热模的组织中测量,稳定在37°C左右。测试了基于0.9 mm厚聚合物部件和10,80或150 μ m厚Cu层的封装。同时考虑了电源对模型的影响。当热源功率不高于0.5 W时,当封装铜层厚度至少为80µm时,本模型满足热安全的最高温度限制(43°C)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal management with a new encapsulation approach for a medical device
This paper presents a study on the encapsulation of an interventional medical device, for use temporarily inside the human esophagus for cardiac imaging. A metallized polymer encapsulation, a potential encapsulation approach for simplifying the device assembly, was evaluated experimentally with regard to thermal performance. The encapsulation was fabricated by 3D printing followed by electroplating. The surface temperature of a simplified model of the device, with this double layer encapsulation, was measured in a tissue mimicking thermal phantom, stabilized at around 37 °C. Encapsulations based on a 0.9 mm thick polymer part with a 10, 80 or 150 µm thick Cu layer were tested. The effect of the power supplied to the model was also considered. The present model satisfied the maximum temperature limit for thermal safety (43 °C) when the Cu layer thickness of the encapsulation was at least 80 µm, for a heat source power not higher than 0.5 W.
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