反应气体定时射频磁控溅射制备Ni3FeN薄膜及表征

W. Techitdheera, C. Thassana, W. Pecharapa, J. Nukaew
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引用次数: 0

摘要

采用反应气体定时射频磁控溅射的方法,在室温条件下在玻璃基板上沉积Ni3FeN薄膜,条件为:(1)Ar∶N2气体的时间周期(2)Ar∶N2气体的流速。结果表明,溅射速率随时间的增加和Ar∶N2气体掺量的增加而增加。用x射线衍射研究了薄膜的晶体结构,发现了Ni3FeN(200)平面的fcc结构。晶格常数随氮气流速的增大而增大,随氩气流速的增大而减小。用原子力显微镜观察了薄膜的晶粒尺寸,晶粒尺寸范围在20 ~ 120 nm之间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Growth and characterization of Ni3FeN thin films by reactive gas timing RF magnetron sputtering
Ni3FeN films were deposited on the glass substrate at room temperature by reactive gas timing rf magnetron sputtering, with two conditions: (1) a time period of Ar∶N2 gas (2) a flow rate of Ar∶N2 gas. Our results show that sputter rate increase with increasing of a time period and the rate of Ar∶N2 gas. The crystal structure of thin films was investigated by x-ray diffraction show fcc structure of Ni3FeN (200) plane. The lattice constants increase with increasing of the flow rate of the nitrogen gas but it decrease with increasing of a time period of Ar gas. The grain size of thin films were investigated by atomic force microscope show the size range between 20 – 120 nm.
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