无结和反转模式FDSOI晶体管全工作状态下漏极电流变异性的表征和建模

D. Bosch, J. Colinge, G. Ghibaudo, X. Garros, S. Barraud, J. Lacord, B. Sklénard, L. Brunet, P. Batude, C. Fenouillet-Béranger, J. Cluzel, R. Kies, J. Hartmann, C. Vizioz, G. Audoit, F. Balestra, F. Andrieu
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引用次数: 5

摘要

我们证明了无结完全耗尽绝缘体上硅(JL FDSOI)晶体管的一个独特特征:体传导和累积传导的存在使得标准的vt -变异性研究不完整。对于JL晶体管,我们建议对从亚阈值到累积的所有操作机制中的(局部和全局)可变性进行原始分析。我们证明了VT周围的电流变异性对背偏置VB和薄膜厚度$(\ mathm {t}_{\ mathm {si}})$均匀性高度敏感。在1V栅极电压(V G)、$\mathrm{L}=18$ nm栅极长度和$\mathrm{W}=20 $ mathrm{nm}$宽度下,我们首次通过实验证明了无结积累模式(JAM)与反转模式(IM)相比,漏极电流(ID)的局部可变性降低了70%。这是由于杂质筛选,降低了随机掺杂波动可变性的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
All-operation-regime characterization and modeling of drain current variability in junctionless and inversion-mode FDSOI transistors
We evidence a unique feature of junctionless Fully-Depleted Silicon-On-Insulator (JL FDSOI) transistors: the presence of both bulk and accumulation conduction renders standard VT-variability studies incomplete. For JL transistors, we rather propose an original analysis of the (local and global) variability in all-operation-regimes, from subthreshold to accumulation. We evidence that the current variability around VT is highly sensitive to back-bias VB and film thickness $(\mathrm{t}_{\mathrm{si}})$ uniformity. We demonstrate experimentally for the first time up to 70% lower drain current (ID) local variability for Junctionless Accumulation Mode (JAM) vs. inversion mode (IM) at 1V gate voltage (V G), $\mathrm{L}=18$ nm gate length and $\mathrm{W}=20\mathrm{nm}$ width. This is attributed to the impurity screening, lowering the impact of Random Dopant Fluctuations variability.
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