基于芯片的先进3D系统架构的主动中介技术

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Pub Date : 2019-05-28 DOI:10.1109/ECTC.2019.00092

P. Coudrain, J. Charbonnier, A. Garnier, P. Vivet, R. Vélard, A. Vinci, F. Ponthenier, A. Farcy, R. Segaud, P. Chausse, L. Arnaud, D. Lattard, E. Guthmuller, G. Romano, A. Gueugnot, F. Berger, J. Beltritti, T. Mourier, M. Gottardi, S. Minoret, C. Ribiére, G. Romero, Pierre-Emile Philip, Y. Exbrayat, D. Scevola, D. Campos, M. Argoud, N. Allouti, R. Eleouet, César Fuguet Tortolero, C. Aumont, D. Dutoit, Corinne Legalland, J. Michailos, S. Chéramy, G. Simon

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引用次数: 37

摘要

我们报告了第一个成功的技术集成芯片上的有源硅中间层，充分加工，封装和测试。讨论了基于芯片的体系结构的优点。建立了技术，并重点介绍了三维互连的过程和表征。三维封装提出，直到成功的结构测试和表征的演示。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interconnects process and characterization. 3D packaging is presented up to the successful structural test and characterization of the demonstrator.

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2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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