离子注入引入的三维FinFET掺杂谱模拟及其对器件性能的影响

Liping Wang, A. Brown, B. Cheng, A. Asenov
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引用次数: 0

摘要

基于准解析方法模拟离子注入的仿真程序Anadope3D得到了改进,包含了一组基于Pearson分布函数的解析注入模型,该模型简洁且计算效率高。该c++模块已集成到GSS原子器件模拟器GARAND中,使离子注入产生的更真实的掺杂分布能够用于TCAD FinFET模拟。对物理栅极长度为20nm的SOI FinFET进行了仿真,包括随机离散掺杂剂(RDD)的统计仿真。研究了真实三维掺杂对FinFET性能的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation of 3D FinFET doping profiles introduced by ion implantation and the impact on device performance
A simulation program, Anadope3D, developed to model ion implantations in FinFETs based on quasi-analytic methods, has been improved to include a set of analytical implantation models based on a Pearson distribution function, which is concise and computationally efficient. This C++ module has been integrated into the GSS atomistic device simulator GARAND, which enables more realistic doping distributions arising from ion implantation to be used for TCAD FinFET simulations. Simulations are performed on an example of an SOI FinFET with physical gate length of 20nm, including statistical simulations with Random Discrete Dopants (RDD). The impact of the realistic 3D doping profile on FinFET performance has been investigated.
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