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引用次数: 10
摘要
我们报道了第一个采用6 /spl μ m厚多晶硅作为结构材料和5 V 0.8 /spl μ m CMOS工艺在Analog Devices模块化mems工艺中制造的集成表面微加工z轴框架微陀螺仪。该振动微陀螺仪在真空中工作，通过电容感应感应感应科里奥利加速度来测量z轴旋转速率。估计驱动运动幅值为2 /spl mu/m。框架陀螺仪机械解耦驱动和传感运动稳定运行。集成电路和机械结构在同一衬底允许信号传感低寄生。adi公司制造的表面微机械集成z轴框架陀螺仪在70毫伏环境压力下的测量噪声本底为0.05度/秒//声压径向/赫兹，比例系数为0.33 mV/度/秒。
We report the first integrated surface-micro machined z-axis frame microgyroscope fabricated in the Analog Devices Modular-MEMS process using 6 /spl mu/m thick polysilicon as the structural material and 5 V 0.8 /spl mu/m CMOS process. This vibratory microgyroscope, which operates in vacuum, measures the z-axis rotation rate by sensing the induced Coriolis acceleration using capacitive sensing. The amplitude of drive motion was estimated to be 2 /spl mu/m. The frame gyroscope mechanically decouples the drive and sense motion for stable operation. Integration of circuits and mechanical structures on the same substrate allowed signal sensing with low parasitics. The surface micromachined integrated z-axis frame gyroscope fabricated at Analog Devices has a measured noise floor of 0.05 deg/s//spl radic/Hz and a scale factor of 0.33 mV/deg/sec at 70 mtorr ambient pressure.
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