利用单栅极Mosfet改变其氧化物厚度以提高电导率的新型Finfet的电压和电流特性的仿真与比较

T. Reddy, A. Deepak
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引用次数: 0

摘要

目的:通过改变FinFET和单栅MOSFET的氧化物厚度,在2 ~ 20 nm范围内模拟它们的电流和电压特性。材料与方法:在NANO HUB工具模拟环境中,通过改变2 nm至20 nm的氧化物厚度,比较FINFET (n=320)与MOSFET (n=320)的电导率。结果:FINFET的电导(2.66*10-4 mho P<0.05)明显高于单栅极MOSFET (1.64*10-4 mho)。FINFET和MOSFET的最佳电导率厚度分别为2nm和2nm。结论:在本研究范围内,氧化层厚度为2 nm的FINFET具有最佳导电性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation and Comparison of Voltage and Current Characteristics of Novel Finfet by Varying its Oxide Thickness with Single Gate Mosfet for Improved Conductivity
Aim: The current and voltage characteristics of FinFET and single gate MOSFET are simulated by varying their oxide thickness ranging from 2 nm to 20 nm. Materials and Methods: The electrical conductance of FINFET (n= 320) was compared with MOSFET (n=320) by varying oxide thickness ranging from 2 nm to 20 nm in the NANO HUB tool simulation environment. Results: FINFET has significantly higher conductance (2.66*10-4 mho P<0.05) than single gate MOSFET (1.64*10-4 mho). The optimal thickness for maximum conductivity was 2nm for FINFET, and 2 nm for MOSFET. Conclusion: Within the limits of this study, FINFET with oxide thickness of 2 nm offers the best conductivity.
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来源期刊
Alinteri Journal of Agriculture Sciences
Alinteri Journal of Agriculture Sciences AGRICULTURE, MULTIDISCIPLINARY-
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