{"title":"从前端看半导体趋势","authors":"M. Nagao","doi":"10.23919/PanPacific.2019.8696919","DOIUrl":null,"url":null,"abstract":"The external factors around the semiconductor has changed dynamically. The factors include the smartphone growth that had lead the market about decades has slowed down and the growth of the advanced technology needs for realizing the society using 5G and AI, constructing the datacenters to handle the huge data and the trade conflict between US and China etc. Toppan printings has covered the front-end business including leadframe, photmasks, OCF(On-chip colour filter) and FCBGA(Flip Chip Ball Grid Array) and have our own business forecast and the analysis. This paper will give you the analysis and the suggestion for the current situation of the semiconductor market and the forecast based on the view from the frontend semiconductor side.","PeriodicalId":6747,"journal":{"name":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"1991 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Semiconductor Trend From The Front-End View\",\"authors\":\"M. Nagao\",\"doi\":\"10.23919/PanPacific.2019.8696919\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The external factors around the semiconductor has changed dynamically. The factors include the smartphone growth that had lead the market about decades has slowed down and the growth of the advanced technology needs for realizing the society using 5G and AI, constructing the datacenters to handle the huge data and the trade conflict between US and China etc. Toppan printings has covered the front-end business including leadframe, photmasks, OCF(On-chip colour filter) and FCBGA(Flip Chip Ball Grid Array) and have our own business forecast and the analysis. This paper will give you the analysis and the suggestion for the current situation of the semiconductor market and the forecast based on the view from the frontend semiconductor side.\",\"PeriodicalId\":6747,\"journal\":{\"name\":\"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)\",\"volume\":\"1991 1\",\"pages\":\"1-6\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/PanPacific.2019.8696919\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/PanPacific.2019.8696919","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The external factors around the semiconductor has changed dynamically. The factors include the smartphone growth that had lead the market about decades has slowed down and the growth of the advanced technology needs for realizing the society using 5G and AI, constructing the datacenters to handle the huge data and the trade conflict between US and China etc. Toppan printings has covered the front-end business including leadframe, photmasks, OCF(On-chip colour filter) and FCBGA(Flip Chip Ball Grid Array) and have our own business forecast and the analysis. This paper will give you the analysis and the suggestion for the current situation of the semiconductor market and the forecast based on the view from the frontend semiconductor side.