{"title":"集成电子系统电磁分析的域分解和多尺度有限元","authors":"A. Cangellaris, Hong Wu","doi":"10.1109/ISEMC.2005.1513637","DOIUrl":null,"url":null,"abstract":"A finite element methodology is presented for computer-aided analysis and design of the interconnect and power distribution network of integrated, packaged electronic systems. The concept of multi-scale finite elements is introduced to describe the generalization of the traditional finite element, understood as a small finite volume of the computational domain over which the unknown field quantity is approximated in terms of interpolate polynomial functions, to a generalized, electromagnetic behavior-baring, scaleable, mathematical macro-model, which captures the electromagnetic response of a sub-region of the computational domain, in a manner seamlessly compatible with the finite element modeling infrastructure. Such generalized finite elements, combined with a domain decomposition methodology suitable for multi-layered electronic substrate electromagnetic modeling, help enhance the modeling versatility and applicability of finite elements to integrated electronic system modeling.","PeriodicalId":6459,"journal":{"name":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","volume":"43 1","pages":"817-822 Vol. 3"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Domain decomposition and multi-scale finite elements for electromagnetic analysis of integrated electronic systems\",\"authors\":\"A. Cangellaris, Hong Wu\",\"doi\":\"10.1109/ISEMC.2005.1513637\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A finite element methodology is presented for computer-aided analysis and design of the interconnect and power distribution network of integrated, packaged electronic systems. The concept of multi-scale finite elements is introduced to describe the generalization of the traditional finite element, understood as a small finite volume of the computational domain over which the unknown field quantity is approximated in terms of interpolate polynomial functions, to a generalized, electromagnetic behavior-baring, scaleable, mathematical macro-model, which captures the electromagnetic response of a sub-region of the computational domain, in a manner seamlessly compatible with the finite element modeling infrastructure. Such generalized finite elements, combined with a domain decomposition methodology suitable for multi-layered electronic substrate electromagnetic modeling, help enhance the modeling versatility and applicability of finite elements to integrated electronic system modeling.\",\"PeriodicalId\":6459,\"journal\":{\"name\":\"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.\",\"volume\":\"43 1\",\"pages\":\"817-822 Vol. 3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-10-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2005.1513637\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2005.1513637","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Domain decomposition and multi-scale finite elements for electromagnetic analysis of integrated electronic systems
A finite element methodology is presented for computer-aided analysis and design of the interconnect and power distribution network of integrated, packaged electronic systems. The concept of multi-scale finite elements is introduced to describe the generalization of the traditional finite element, understood as a small finite volume of the computational domain over which the unknown field quantity is approximated in terms of interpolate polynomial functions, to a generalized, electromagnetic behavior-baring, scaleable, mathematical macro-model, which captures the electromagnetic response of a sub-region of the computational domain, in a manner seamlessly compatible with the finite element modeling infrastructure. Such generalized finite elements, combined with a domain decomposition methodology suitable for multi-layered electronic substrate electromagnetic modeling, help enhance the modeling versatility and applicability of finite elements to integrated electronic system modeling.