基于铁电f0.5 zr0.5 o2的SoC兼容1t1 C FeRAM存储阵列

J. Okuno, Takafumi Kunihiro, Kenta Konishi, Hideki Maemura, Yusuke Shute, Fumitaka Sugaya, M. Materano, T. Ali, Kati Kuehnel, Konrad Seide, U. Schroeder, T. Mikolajick, M. Tsukamoto, T. Umebayashi
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引用次数: 40

摘要

实验证明了铁电hfo2基1t1 C FeRAM的基本存储阵列操作。优化了TiN/ $\ mathm {Hf}_{0.5}\ mathm {Zr}_{0.5}\ mathm {O}_{2}(\ mathm {HZO}$)/TiN堆栈组成的金属/铁电/金属(MFM)电容器,适用于低于500℃的工艺。结构显示出优异的性能,如剩余极化$2\ mathm {P}_{\ mathm {r}} > 4\vert \mu\ mathm {C}/\ mathm {cm}^{2}$,续航时间> 1011次,在85°C下数据保留10年。此外,MFM电容器已成功集成到64 kbit 1T1C FeRAM阵列中,包括用于阵列操作的专用电路。后端线(BEOL)布线显示底层CMOS逻辑没有退化。程序和读取操作得到了适当的控制,在2.5 v的工作电压和14 ns的工作速度下实现了100%的位功能。该技术符合低功耗片上系统(SoC)中用于物联网应用的最后一级现金(LLC)和嵌入式非易失性存储器(NVM)的要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SoC compatible 1 T1 C FeRAM memory array based on ferroelectric Hf0.5Zr0.5O2
This paper experimentally demonstrates fundamental memory array operation of a ferroelectric HfO2-based 1 T1 C FeRAM. Metal/ferroelectric/metal (MFM) capacitors consisting of a TiN/ $\mathrm{Hf}_{0.5}\mathrm{Zr}_{0.5}\mathrm{O}_{2}(\mathrm{HZO}$)/TiN stack were optimized for a sub 500°C process. Structures revealed excellent performance such as remanent polarization $2\mathrm{P}_{\mathrm{r}} > 4\vert \mu\mathrm{C}/\mathrm{cm}^{2}$, endurance> 1011 cycles, and 10 years data retention at 85°C. Furthermore, the MFM capacitors were successfully integrated into a 64 kbit 1T1C FeRAM array including our dedicated circuit for array operation. Back-end-of-line (BEOL) wiring showed no degradation of the underlying CMOS logic. Program and read operation were properly controlled resulting in 100 % bit functionality at an operation voltage of2.5 Vand operating speed at 14 ns. This technology matches requirements of last level cash (LLC) and embedded non-volatile-memory (NVM) in low power System-on-a-Chip (SoC) for IoT applications.
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