{"title":"基于BCB的密封腔实现的粘接晶圆键合CMUTs的表征","authors":"Rayyan Manwar, S. Chowdhury","doi":"10.1109/ISCAS.2016.7539108","DOIUrl":null,"url":null,"abstract":"This paper presents the characterization results of a CMUT array fabricated using a Bisbenzocyclobutene (BCB) based adhesive wafer bonding technology. A resonant frequency of 17.3 MHz has been measured using an Agilent ENA5061B Vector Network Analyzer that is in good agreement with the results from 3-D FEA using IntelliSuite™. The extracted coupling coefficient from the electrical impedance measurement shows 40% higher transduction efficiency as compared to another research work published elsewhere. Optical measurements of the membrane deflection using a Polytec™ laser Doppler vibrometer and pitch catch mode experimental results validate the CMUT operation in both transmit and receive mode.","PeriodicalId":6546,"journal":{"name":"2016 IEEE International Symposium on Circuits and Systems (ISCAS)","volume":"23 1","pages":"2531-2534"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Characterization of adhesive wafer bonded CMUTs realized from BCB based sealed cavity\",\"authors\":\"Rayyan Manwar, S. Chowdhury\",\"doi\":\"10.1109/ISCAS.2016.7539108\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the characterization results of a CMUT array fabricated using a Bisbenzocyclobutene (BCB) based adhesive wafer bonding technology. A resonant frequency of 17.3 MHz has been measured using an Agilent ENA5061B Vector Network Analyzer that is in good agreement with the results from 3-D FEA using IntelliSuite™. The extracted coupling coefficient from the electrical impedance measurement shows 40% higher transduction efficiency as compared to another research work published elsewhere. Optical measurements of the membrane deflection using a Polytec™ laser Doppler vibrometer and pitch catch mode experimental results validate the CMUT operation in both transmit and receive mode.\",\"PeriodicalId\":6546,\"journal\":{\"name\":\"2016 IEEE International Symposium on Circuits and Systems (ISCAS)\",\"volume\":\"23 1\",\"pages\":\"2531-2534\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Symposium on Circuits and Systems (ISCAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISCAS.2016.7539108\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Symposium on Circuits and Systems (ISCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISCAS.2016.7539108","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Characterization of adhesive wafer bonded CMUTs realized from BCB based sealed cavity
This paper presents the characterization results of a CMUT array fabricated using a Bisbenzocyclobutene (BCB) based adhesive wafer bonding technology. A resonant frequency of 17.3 MHz has been measured using an Agilent ENA5061B Vector Network Analyzer that is in good agreement with the results from 3-D FEA using IntelliSuite™. The extracted coupling coefficient from the electrical impedance measurement shows 40% higher transduction efficiency as compared to another research work published elsewhere. Optical measurements of the membrane deflection using a Polytec™ laser Doppler vibrometer and pitch catch mode experimental results validate the CMUT operation in both transmit and receive mode.
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