热等离子体射流诱导退火技术的发展及其在电子器件制造中的应用

S. Higashi
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引用次数: 0

摘要

研究了常压微热等离子体射流(mTPJ)辐照非晶硅(aSi)带及其在薄膜晶体管(TFT)制造中的应用。宽度小于3mm的条形通道为eŠective,通过过滤eŠect来消除随机晶界。mTPJ的高速扫描抑制了Si熔液的传质和in晶粒缺陷的产生。通过引入条形沟道,成功制备了具有503 cm2V-1s-1 (n沟道)高平均场eŠect迁移率(mFE)的高性能TFTs,器件间变化小。用带状通道TFTs制作的CMOS移位寄存器在5V电源下工作,工作频率为50MHz。这些结果表明m条形通道TPJ结晶在下一代TFT应用中是很有前景的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of Thermal Plasma Jet Induced Annealing Technology and Its Application to Electronic Device Fabrication
Atmospheric pressure micro-thermal-plasma-jet (mTPJ) irradiation on amorphous silicon (aSi) strips and its application to thin ˆlm transistor (TFT) fabrication have been investigated. Strip channel with the width smaller than 3 mm is eŠective to eliminate random grain boundaries by ˆltering eŠect. High speed scanning of mTPJ suppresses mass transfer of molten Si and generation of in grain defects. By introducing strip channel, high performance TFTs with a high average ˆeld eŠect mobility (mFE) of 503 cm2V-1s-1 (nchannel) are successfully fabricated with small device to device variation. CMOS shift register fabricated with strip channel TFTs was operated by 5V power supply at 50MHz. These results indicate that mTPJ crystallization of strip channel is quite promising for next generation TFT applications.
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