Jinbang Song, Yu-Duo Fu, K. Song, Qianling Zhu, Xiao-Wen Peng, Y. Hua, Y. Zhou, Xiu-hua Guo, Shivrina An, Ying-Xuan Ma
{"title":"P和Ce相互作用对铜性能的影响","authors":"Jinbang Song, Yu-Duo Fu, K. Song, Qianling Zhu, Xiao-Wen Peng, Y. Hua, Y. Zhou, Xiu-hua Guo, Shivrina An, Ying-Xuan Ma","doi":"10.1080/02670836.2023.2230004","DOIUrl":null,"url":null,"abstract":"The effect of interaction between Ce and P on the microstructure and properties of copper has been rarely reported. In this study, it was investigated by utilising the OM, EPMA, SEM and TEM techniques, combined with conductivity and tensile tests. The results indicated that the grain size and conductivity of as-cast copper could be significantly influenced by the interaction. More importantly, the plasticity of as-cast copper did not seriously damage by the interaction, and the elongation of as-cast 3# (Cu-0.016P-0.075Ce) was still up to 39.3%. This is due to a strong binding force of the coherent interface between CeP and copper.","PeriodicalId":18232,"journal":{"name":"Materials Science and Technology","volume":"34 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2023-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of interaction between P and Ce on properties of copper\",\"authors\":\"Jinbang Song, Yu-Duo Fu, K. Song, Qianling Zhu, Xiao-Wen Peng, Y. Hua, Y. Zhou, Xiu-hua Guo, Shivrina An, Ying-Xuan Ma\",\"doi\":\"10.1080/02670836.2023.2230004\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The effect of interaction between Ce and P on the microstructure and properties of copper has been rarely reported. In this study, it was investigated by utilising the OM, EPMA, SEM and TEM techniques, combined with conductivity and tensile tests. The results indicated that the grain size and conductivity of as-cast copper could be significantly influenced by the interaction. More importantly, the plasticity of as-cast copper did not seriously damage by the interaction, and the elongation of as-cast 3# (Cu-0.016P-0.075Ce) was still up to 39.3%. This is due to a strong binding force of the coherent interface between CeP and copper.\",\"PeriodicalId\":18232,\"journal\":{\"name\":\"Materials Science and Technology\",\"volume\":\"34 1\",\"pages\":\"\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2023-06-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science and Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/02670836.2023.2230004\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science and Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/02670836.2023.2230004","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Effect of interaction between P and Ce on properties of copper
The effect of interaction between Ce and P on the microstructure and properties of copper has been rarely reported. In this study, it was investigated by utilising the OM, EPMA, SEM and TEM techniques, combined with conductivity and tensile tests. The results indicated that the grain size and conductivity of as-cast copper could be significantly influenced by the interaction. More importantly, the plasticity of as-cast copper did not seriously damage by the interaction, and the elongation of as-cast 3# (Cu-0.016P-0.075Ce) was still up to 39.3%. This is due to a strong binding force of the coherent interface between CeP and copper.
期刊介绍:
《Materials Science and Technology》(MST) is an international forum for the publication of refereed contributions covering fundamental and technological aspects of materials science and engineering.